KLA-Tencor to acquire Belgium's ICOS Vision Systems
ICOS's primary business is the design and manufacture of inspection equipment for semiconductor packaging and interconnect applications. ICOS's systems also perform inspection of solar wafers and solar cells at different stages of production enabling solar manufacturers to effectively monitor the production process. The inspection modules allow fast, efficient and reliable optical classification of solar cells at the different stages of the production flow.

The ICOS WI-3200/3300 Wafer Inspector combines surface inspection and 2D/3D bump inspection in one high speed pass.

KLA / ICOS

WI-3300

Component Inspector, tray-based.
CI-8250/8450 and CI-9250/9450 products are high volume systems that perform 2D and 3D inspection of all devices that are handled in trays such as QFP, BGA, CSP and TSOP.

CI-8450

The ICOS WI-2220 is a wafer inspection tool designed specifically for LED defect inspection that assists device makers in lowering their production costs, while increasing device reliability. With the WI-2220, device makers can automate inspection of smaller die sizes that inhibit manual inspection, and for larger die sizes that require rapid corrective action to limit costly materials risk. The new system allows defect inspection of whole and diced wafers up to 200mm, with macro inspection sensitivity in the pre- and post-dice inspection (i.e. front- and back-end) of LED wafers.

WI-2220

Component Inspector, tray-based.
CI-5150/5250 is a medium volume systems that perform 2D and 3D inspection of all devices that are handled in trays such as QFP, BGA, CSP and TSOP.

CI-5250

CI-5150	

Component Inspector, tube-based. The CI-G10 is a fully automatic system for the final inspection of semiconductor components of devices handled in tubes. Typical components include SO devices and QFN or other LFCSP’s. The CI-G10 performs the optical inspection and, if required, the taping of these components.

CI-G10

The WI-3000 series inspects both two- and three-dimensional aspects and is designed for high speed inspection of all the bumps on a wafer. 

WI-3000

The WI-2000 series inspects a variety of twodimensional (2D) items, such as the surface quality of the wafer, the quality of the wafer cutting or the
2D aspects of the bump. 

WI-2000

The ICOS CI-T120S and ICOS CI-T130S systems offer 2D and 3D metrology and inspection for Flip-Chip packaging, combining bump inspection, substrate top
and bottom surface inspection and substrate warpage inspection in one system.

CI-T120S

CI-8050

Component Inspector, tray-based.
CI-8250/8450 and CI-9250/9450 products are high volume systems that perform 2D and 3D inspection of all devices that are handled in trays such as QFP, BGA, CSP and TSOP. ICOS CI-9x50 is a fully automatic system for the final inspection of tray-based semiconductor components; it moves the components to the inspection stations, sorts them and, if required, transfers them to tape.

CI-9250

WI-3200

Component Inspector, tray-based.
CI-3050 is a semi-automatic system that perform 2D and 3D inspection of all devices that are handled in trays such as QFP, BGA, CSP and TSOP. 

CI-3050

The ICOS WI-2200/2300, which perform 100% automated optical inspection and metrology of microelectronic devices on a variety of wafer substrates. This inspection system combines surface inspection and 2D bump inspection for semiconductor ICs, optoelectronics, advanced packaging, and MEMS.

WI-2300

the ICOS PVI-6 inspection module—designed for high speed, automated, optical in-line inspection of both the front surface and back surface of monocrystalline and polycrystalline solar wafers and cells, as well as the fast and reliable optical classification of solar cells at the final stage of the production flow. 

PVI-6

CI-T130S

WI-2200

CI-T130

CI-9450

The CI-T120 Component Inspector continues ICOS' tradition of excellence and performance. Although the successful concept of its predecessors still lives on in the new machine, the CI-T120 is armed with the latest innovations in vision technology and component handling. The machine is configured for high speed, making it the optimal choice for high-volume production of Gull Wing, BGA, CSP and QFN devices.

CI-T120

Component Inspector, tray-based.
CI-8250/8450 and CI-9250/9450 products are high volume systems perform 2D and 3D inspection of all devices that are handled in trays such as QFP, BGA, CSP and TSOP.

CI-8250

The ICOS WI-2250 system's automated optical inspection capabilities enable higher quality LED and MEMS products at increased yields. The new system will allow defect inspection of whole and diced wafers up to 200mm, with macro inspection sensitivity in the pre- and post-dice inspection (i.e., front- and back-end) of high-brightness (HB) LEDs and MEMS wafers. 

WI-2250

Designed specifically for defect inspection and 2D metrology for LED applications, the ICOS WI-2280 also provides enhanced inspection capabilities and increased flexibility for microelectromechanical systems (MEMS) and semiconductor wafers spanning two inches to eight inches in size.

WI-2280

HM-200

CI-T53P

The CI-T620 is a fully automated optical inspector of integrated circuit (IC) packages for 3D measurements and package quality with dual tapers for improved output. The new system is designed to offer superior inspection accuracy, reduced cost of ownership (CoO), and increased flexibility.

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KLA / ICOS

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現在の掲載品

全ての製品

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トップKLA / ICOS Defect Inspection

CI-3050

CI-9250

WI-3200

WI-2200

CI-3050

CI-9250

WI-3200

WI-2200

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すべてのKLA / ICOS Defect Inspection