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KLA 2351
  • KLA 2351
  • KLA 2351
  • KLA 2351
説明
Bright field detection No missing parts Current size : 12
構成
構成なし
OEMモデルの説明
The KLA / TENCOR 2351 is a Bright-Field Wafer Inspection System. The TENCOR 2351 can be used with 200mm wafer sizes. In July of 2001, an upgrade to the 2350 was introduced, the 2351, which offers enhancements in sensitivity, throughput and ease of use. The KLA 2135 is a wafer inspection system that detects all types of yield-relevant defects on all process layers with high capture rates. It has a two- to three-times throughput improvement over the earlier model KLA 2132 and uses advanced sensor and image processing technologies. The 2135 consistently detects the widest range of defects at the speeds required for high-volume wafer production.
ドキュメント

ドキュメントなし

verified-listing-icon

検証済み

カテゴリ
Defect Inspection

最終検証: 60日以上前

主なアイテムの詳細

状態:

Used


稼働ステータス:

Deinstalled


製品ID:

107147


ウェーハサイズ:

8"/200mm, 12"/300mm


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

KLA

2351

verified-listing-icon
検証済み
カテゴリ
Defect Inspection
最終検証: 60日以上前
listing-photo-ab2de3c4577e45da994776f5b89a617a-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
主なアイテムの詳細

状態:

Used


稼働ステータス:

Deinstalled


製品ID:

107147


ウェーハサイズ:

8"/200mm, 12"/300mm


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Bright field detection No missing parts Current size : 12
構成
構成なし
OEMモデルの説明
The KLA / TENCOR 2351 is a Bright-Field Wafer Inspection System. The TENCOR 2351 can be used with 200mm wafer sizes. In July of 2001, an upgrade to the 2350 was introduced, the 2351, which offers enhancements in sensitivity, throughput and ease of use. The KLA 2135 is a wafer inspection system that detects all types of yield-relevant defects on all process layers with high capture rates. It has a two- to three-times throughput improvement over the earlier model KLA 2132 and uses advanced sensor and image processing technologies. The 2135 consistently detects the widest range of defects at the speeds required for high-volume wafer production.
ドキュメント

ドキュメントなし