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KLA AIT III
  • KLA AIT III
  • KLA AIT III
  • KLA AIT III
説明
説明なし
構成
構成なし
OEMモデルの説明
The AIT III is a high-throughput darkfield wafer inspection tool that can capture small defects resulting from the transition to 0.13 µm and smaller design rules. It has advanced noise suppression capabilities, making it suitable for films, CMP, photo, and etch applications. It is ideal for the development and ramp of 0.13 µm technology products and extends a fab’s current capability for production tool monitoring of yield-limiting defects. It offers improved capture of CMP and pattern transfer defects, superior suppression of grain, pattern noise and color variation, high defect signal-to-noise ratio with maximized surface selectivity, high throughput at required sensitivity, fast automated recipe setup, rigorous system-to-system matching, and is field upgradeable from the AIT II. It is also 300 mm capable with flexible automation options.
ドキュメント

ドキュメントなし

verified-listing-icon

検証済み

カテゴリ
Defect Inspection

最終検証: 60日以上前

主なアイテムの詳細

状態:

Parts Tool


稼働ステータス:

不明


製品ID:

90112


ウェーハサイズ:

不明


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

KLA

AIT III

verified-listing-icon
検証済み
カテゴリ
Defect Inspection
最終検証: 60日以上前
listing-photo-8e70bb31fda049658af241b08b1a1d9f-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
主なアイテムの詳細

状態:

Parts Tool


稼働ステータス:

不明


製品ID:

90112


ウェーハサイズ:

不明


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし
構成
構成なし
OEMモデルの説明
The AIT III is a high-throughput darkfield wafer inspection tool that can capture small defects resulting from the transition to 0.13 µm and smaller design rules. It has advanced noise suppression capabilities, making it suitable for films, CMP, photo, and etch applications. It is ideal for the development and ramp of 0.13 µm technology products and extends a fab’s current capability for production tool monitoring of yield-limiting defects. It offers improved capture of CMP and pattern transfer defects, superior suppression of grain, pattern noise and color variation, high defect signal-to-noise ratio with maximized surface selectivity, high throughput at required sensitivity, fast automated recipe setup, rigorous system-to-system matching, and is field upgradeable from the AIT II. It is also 300 mm capable with flexible automation options.
ドキュメント

ドキュメントなし