説明
説明なし構成
構成なしOEMモデルの説明
The AIT III is a high-throughput darkfield wafer inspection tool that can capture small defects resulting from the transition to 0.13 µm and smaller design rules. It has advanced noise suppression capabilities, making it suitable for films, CMP, photo, and etch applications. It is ideal for the development and ramp of 0.13 µm technology products and extends a fab’s current capability for production tool monitoring of yield-limiting defects. It offers improved capture of CMP and pattern transfer defects, superior suppression of grain, pattern noise and color variation, high defect signal-to-noise ratio with maximized surface selectivity, high throughput at required sensitivity, fast automated recipe setup, rigorous system-to-system matching, and is field upgradeable from the AIT II. It is also 300 mm capable with flexible automation options.ドキュメント
ドキュメントなし
KLA
AIT III
検証済み
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Parts Tool
稼働ステータス:
不明
製品ID：
90112
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA
AIT III
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Parts Tool
稼働ステータス:
不明
製品ID：
90112
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
The AIT III is a high-throughput darkfield wafer inspection tool that can capture small defects resulting from the transition to 0.13 µm and smaller design rules. It has advanced noise suppression capabilities, making it suitable for films, CMP, photo, and etch applications. It is ideal for the development and ramp of 0.13 µm technology products and extends a fab’s current capability for production tool monitoring of yield-limiting defects. It offers improved capture of CMP and pattern transfer defects, superior suppression of grain, pattern noise and color variation, high defect signal-to-noise ratio with maximized surface selectivity, high throughput at required sensitivity, fast automated recipe setup, rigorous system-to-system matching, and is field upgradeable from the AIT II. It is also 300 mm capable with flexible automation options.ドキュメント
ドキュメントなし