説明
wafer bumping inspection構成
構成なしOEMモデルの説明
Introduced in 2001, 3Di-8000 automated wafer bump inspection system is the first complete 2D and 3D production worthy bumped wafer inspection system on the market. Building on the full capability of the NSX Series, the 3Di-8000 features the newly commercialized RCS 3D inspection technology. This new patent-pending technology combines high speed and high accuracy 3D inspection by merging the proven concepts of confocal microscopy with innovative optical design and proprietary software. This technology, although still in its infancy, meets and exceeds the performance of existing 3D metrology technologies. The RCS is particularly well suited for the future of 3D bump and other advanced packaging inspection because of its ability to scale down to meet the future requirements of our customers. RCS technology is also capable of meeting the 3D inspection needs of the growing markets of optoelectronics, MEMS and other microstructures.ドキュメント
ドキュメントなし
ONTO / RUDOLPH / AUGUST
3Di-8000
検証済み
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
74746
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / RUDOLPH / AUGUST
3Di-8000
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
74746
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
wafer bumping inspection構成
構成なしOEMモデルの説明
Introduced in 2001, 3Di-8000 automated wafer bump inspection system is the first complete 2D and 3D production worthy bumped wafer inspection system on the market. Building on the full capability of the NSX Series, the 3Di-8000 features the newly commercialized RCS 3D inspection technology. This new patent-pending technology combines high speed and high accuracy 3D inspection by merging the proven concepts of confocal microscopy with innovative optical design and proprietary software. This technology, although still in its infancy, meets and exceeds the performance of existing 3D metrology technologies. The RCS is particularly well suited for the future of 3D bump and other advanced packaging inspection because of its ability to scale down to meet the future requirements of our customers. RCS technology is also capable of meeting the 3D inspection needs of the growing markets of optoelectronics, MEMS and other microstructures.ドキュメント
ドキュメントなし