Onto Innovation is a worldwide leader in the design, development, manufacture and support of process control tools that perform macro defect inspections and metrology, lithography systems, and process control analytical software used by semiconductor wafer and advanced packaging device manufacturers. 

ONTO / RUDOLPH / AUGUST

WAFER VIEW 210

2D defect detection of the wafer’s edge
Metrology of edge feature
Incorporated into the Explorer Cluster

The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership. The edge-gripping handling solution for both automation platform and the inspection modules provides desired cleanliness required for wafer manufacturing. Optional high-sensitivity notch inspection can be added to the configuration. Defects detected are automatically classified and binned at run time to reduce manual operator review.

The system is designed as a multipurpose inspection and sorting system for end of line outgoing quality inspection of 300mm unpatterned wafers. The system allows for identifying, inspecting, and sorting the wafers according to freely definable recipes.

NovusEdge

In 2002, August enhanced NSX product family with the introduction of the affordable 3Di-7500 and a high performance 3Di-8500. The 3Di Series has quickly developed a reputation as an essential tool for those manufacturers with high volume advanced packaging manufacturing processes. With three model options, the 3Di Series is well suited to serve the needs of our customers.


3Di-7500

The Firefly inspection series provides an automated inspection solution for high performance applications like FPGA, CPU/GPU and networking servers in addition to applications with low I/O counts: IC drivers, RF transceivers, wireless connectivity and MEMS.

FIREFLY

The AWX-FSI system is a quality control tool for unpatterned wafers that uses laser darkfield inspection to detect particles, scratches, area defects, and micro roughness (haze) on bare wafers. It is capable of measuring different wafer substrates, materials, and sizes, including bare silicon and doped or coated wafers. The system features automated handling of different open cassette types and a pre-aligner, allowing for flexibility in various environments such as R&D, production, and quality assurance. Additionally, the AWX inspection tool can handle 150mm, 200mm, and 300mm wafers and enables automatic wafer sorting based on inspection results.

AWX-FSI

The NSX-100 is a high-throughput and repeatable macro defect inspection solution that is part of the NSX® Series. It is designed to detect macro defects (defects 0.5 micron and larger) that can occur during various stages of device manufacturing, such as wafer manufacturing, probing, bumping, dicing, or general handling. These defects can have a significant impact on the quality of microelectronic devices. The NSX-100 provides fast and consistent 2D bump inspection and valuable process information for enhanced process control and product consistency. This information can be transferred to Discover™, Rudolph’s yield management software, for further analysis and review. The NSX-100 is suitable for 200 mm applications and has time-tested applications in various markets, including semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS), and micro display markets. It offers automated, 100% advanced macro defect inspection to ensure quality assurance. NSX-100 series systems are able to inspect as many as 97 wafers-per-hour.

NSX-100

The new E25 System provides edge inspection for CMP, etch, clean, deposition, pre-RTP and final QA processes, and is designed to cope with the challenges of edge inspection, including curved surfaces, ever-changing bevel profiles, process variations and nuisance defects.

The NSX-80 is an automated defect inspection system developed by August Technology. It is capable of detecting defects as small as 0.5 microns and is 300mm ready. It can inspect whole wafers, wafers on film frames, die in gel/waffle paks, MCMs, and others. The system features automated data collection and reporting, wafer mapping and identification, and inking. It operates in a menu-based, easy-to-use Windows® NT environment. The NSX-80 solves the problems associated with manual wafer and die inspection, which is slow, inconsistent, and training-intensive. The system offers consistent, accurate, and high-speed inspection with manual or automated handling. Compared to manual inspection, the NSX-80 provides faster and more consistent defect detection and automatically collects data for improved process management. It eliminates operator fatigue, stress, and ongoing training problems while increasing throughput and reducing floor space requirements. The improved quality and consistency of the semiconductor product can also lead to better supplier-customer relations.

NSX-80

DRAGONFLY

The Dragonfly G2 platform is a new, modular system that delivers up to 150% improvement in productivity over legacy systems and exceeds competitive system throughputs. It combines 2D with 3D Truebump™ Technology for accurate copper pillar/bump height measurements, and uses Clearfind™ Technology to detect non-visual residue defects. Advanced sensor technology measures 3D features and CD metrology. The platform is specifically designed to measure, collect, and analyze data from bump interconnects nearing 100 million bumps per wafer using Rudolph’s Discover® software and advanced computing architecture. This provides a flexible, plug-and-play solution for improved productivity and accuracy in the measurement of bump interconnects.

DRAGONFLY G2

NSX-85

NSX-75

The Dragonfly G3 system is a unique 2D imaging technology that provides fast, reliable inspection for sub-micron defects. It is designed to meet today’s R&D needs and tomorrow’s production demands. The system uses Onto Innovation’s patented Truebump® Technology, which combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity. The Dragonfly G3 system also offers Clearfind® Technology for non-visual residue detection and is tightly integrated with control and analytical software for real-time analysis and review. It is suitable for a wide range of applications, including micro bumps, large die, multi-chip packages, reconstituted wafers, redistribution layers (RDL), CMOS image sensors (CIS), MEMS, and more. The system also offers flexible platform options, such as IR defect inspection and review, large die and package support, substrate handling options, waferless recipe creation, rule-based binning and classification, online and offline review capability, and more. Overall, the Dragonfly G3 system is a powerful tool for improving yields through exploratory data analysis down to the bump level.

DRAGONFLY G3

WaferView 220

The NSX® 220 System is an automated macro defect inspection system designed for semiconductor, LED, and MEMS manufacturers. It offers cost-effective back-end macro defect inspection for wafers up to 300mm in size. The system uses gray-scale image analysis to provide fast, accurate inspection and metrology. It can detect traditional advanced macro defects and perform two-dimensional measurements on bumps, probe marks, and edge trim processes. The system features a flexible objective turret, a programmable light tower, a standard docking module, recipe sharing, and a 2D defect and metrology verification standard. It is ideal for manufacturers looking to optimize productivity and minimize the need for operator assistance.

NSX-220

The NSX-70 is an automated micro defect inspection system introduced in 1998 as part of the NSX series. It delivers high-speed, consistent, and reliable defect detection to semiconductor and microelectronic manufacturers. The system assesses the quality of products at several steps in the manufacturing process and feeds critical information about process integrity to yield management or factory automation systems. This data allows for enhanced process control and improved yields. The NSX series is driven by advanced proprietary software and includes integrated yield enhancement tools such as automated data collection and reporting, extensive communication options, and fast, easy setup using Windows®-based menus. Customers can tailor the system towards their specific application, process, or budget by choosing from a range of capabilities including application-specific software, material handling abilities, selectable defect resolution, capability to inspect components made from materials other than silicon, ability to inspect samples ranging from individual integrated circuits to next-generation 300mm wafers, and communications and network options.

NSX-70

B30 is a tool that uses darkfield, brightfield, and color imaging to detect 2D defects on the backside of wafers. It is incorporated into the Explorer Cluster for enhanced functionality.

The NSX-105 is an addition to the NSX Series, which includes the NSX-70, NSX-80, NSX-85, NSX-90 and NSX-95 models. In addition to whole wafer and film frame handling capabilities, the NSX-105 will also have 300mm wafer capability, which was introduced in 2001. This model will provide customers with a wider range of pricing and functionality options within the NSX Series.

NSX-105

The NSX-115 is a model in the NSX Series, which provides fast, repeatable, advanced macro inspection to detect defects created during wafer manufacturing, probing, bumping and dicing or through general handling. The NSX System detects probe marks and generates location and size information and other parameters. The WaferWoRx analysis module converts what has been a manual and time-consuming process of gathering scrub data from various tools, correlating the data, and sifting through for trends, to automated data collection and analysis completed in a single step. It breaks the overall probing error into its core components (prober, probe card, setup), enabling rapid problem resolution. The WaferWoRx probe process analysis capability is available now on the NSX Series and can be ordered as an upgrade for the NSX 100, NSX 105 or NSX 115 models. It also can prequalify test cells without risk to production wafers and evaluate the readiness of the probing process for advanced technologies such as multi-DUT and high pin count probe cards. Probe card performance can be tracked to predict the need for maintenance, thereby extending card life and maximizing card availability. Macro defects (0.5 µm and larger) can have a major impact on the quality of a microelectronic device and on the yield of the manufacturing process. The NSX uses high speed optical microscopy to identify defective probe marks. This same optical characterization data from a well-designed sample of probe marks serves as the input to the WaferWoRx analysis module for processing and further identification of the error components.

NSX-115

AXI-S

The NSX-95 is an automated inspection system that provides fast and consistent 100% 2D bump inspection and 3D bump height inspection. It ensures the quality of every process step and provides process and defect information for enhanced process control and product consistency. The system also features YieldPilot enhanced data and defect analysis. It has proven applications in semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS) and micro display markets. The NSX-95 has a throughput of 43 wafers per hour for 12"/300mm wafers, 63 wafers per hour for 8"/200mm wafers, 76 wafers per hour for 6"/150mm wafers, 83 wafers per hour for 5"/150mm wafers, and 89 wafers per hour for 4"/100mm wafers.

NSX-95

AXI-930

WaferView 320

AXi 935

The NSX 330 System is an advanced packaging system that improves cost of ownership by enabling multiple applications in a single platform. It combines inspection and metrology to measure multiple applications, including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load. The system offers robust platform technology and is suitable for a wide range of applications. It also offers a choice of inspection platforms with hard-anodized finish which can accommodate 100mm to 330mm whole wafers and features programmable light tower, programmable illumination filter wheel, multiple modes of dark field illumination, standard docking module, resolution flexibility (10µm to 0.5µm), three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer. It teams with edge and backside modules for all-surface solution and offers unique handling solutions (Mems, Taiko, Thin), extreme warpage (>12mm) and ultra-thin (<50µm). The system also supports tool matching, recipe sharing, recipe server, Discover® Software database results archiving, offline inspection and metrology engineering clients as well as offline defect review clients.

NSX-330

NSX-70 and NSX-90 in 1998 was introduced to accommodate additional throughput ranges.

NSX-90

The AXi™ 940 is a frontside inspection module that is designed to reduce cost of ownership by improving defect detectability across multiple front-end applications. It delivers higher resolution than traditional macro systems while maintaining high throughput required in today’s advanced high-volume processes. The AXi 940 addresses customer demand for both productivity and capability by eliminating the small lot penalty and providing numerous automated capabilities, including advanced proprietary defect detection algorithms, real-time binning to on defects of interest, multiple resolution capability, five-minute recipe creation, and three simultaneous defect review methods: on-the-fly, high resolution, whole wafer. The AXi 940 can also team with edge and backside modules for an all-surface solution. Overall, the AXi 940 is a powerful tool for automated, 100% advanced macro defect inspection.

AXi-940

The NSX-320 is an automated macro defect inspection system designed specifically for advanced packaging processes that use through silicon vias (TSVs). It is part of the NSX® family, which is the market leader in this field. The NSX 320 offers specific inspection solutions for processes using TSVs to connect multiple die in a single package, and also serves critical inspection needs for edge trimming metrology, wafer alignment during bonding processes, and sawn wafers on film frames. With high acceleration staging, high-speed multi-processor computing, and highly flexible software capabilities, the NSX 320 delivers industry-leading speed and sensitivity. It features a choice of inspection platforms with a hard-anodized finish that can accommodate 100mm to 300mm whole wafers. The objective turret provides flexibility for inspection applications requiring both high throughput and high resolution, with five available slots and a choice of 1X, 2X, 3X, 5X, 10X, and 20X objectives. The system also includes a programmable light tower, a standard docking module, and has a throughput of up to 120 wph (10µm). Recipe creation takes only five minutes, and the system offers resolution flexibility from 10µm to 0.5µm. It also features three simultaneous color defect review methods: on-the-fly, high resolution, and whole wafer. The NSX-320 can be teamed with edge and backside modules for an all-surface solution.

NSX-320

Introduced in 2001, 3Di-8000 automated wafer bump inspection system is the first complete 2D and 3D production worthy bumped wafer inspection system on the market. Building on the full capability of the NSX Series, the 3Di-8000 features the newly commercialized RCS 3D inspection technology. This new patent-pending technology combines high speed and high accuracy 3D inspection by merging the proven concepts of confocal microscopy with innovative optical design and proprietary software. This technology, although still in its infancy, meets and exceeds the performance of existing 3D metrology technologies. The RCS is particularly well suited for the future of 3D bump and other advanced packaging inspection because of its ability to scale down to meet the future requirements of our customers. RCS technology is also capable of meeting the 3D inspection needs of the growing markets of optoelectronics, MEMS and other microstructures.


3Di-8000

Automated wafer bump inspection and metrology systems.
In 2002, August enhanced NSX product family with the introduction of the affordable 3Di-7500 and a high performance 3Di-8500. The 3Di Series has quickly developed a reputation as an essential tool for those manufacturers with high volume advanced packaging manufacturing processes. With three model options, the 3Di Series is well suited to serve the needs of our customers.

3Di-8500

The F30™ System is an advanced inspection tool designed to blur the lines between dark field micro inspection and traditional macro inspection. It provides automated defect inspection for front-end and outgoing quality (OQA) applications. The system boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite, the F30 System redefines inspection cost of ownership expectations. It has a throughput of up to 120 wph (10µm) and resolution flexibility (10µm to 0.5µm). It also has three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer. The F30 System is suitable for a variety of applications including After develop inspection (ADI), Fab Outgoing QA, Post CMP inspection, and After etch inspection. It can also team with edge and backside modules for an all-surface solution.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

ONTO / RUDOLPH / AUGUST

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トップONTO / RUDOLPH / AUGUST Defect Inspection

NSX-80

NovusEdge

E25

DRAGONFLY G2

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