説明
説明なし構成
F30bOEMモデルの説明
The F30™ System is an advanced inspection tool designed to blur the lines between dark field micro inspection and traditional macro inspection. It provides automated defect inspection for front-end and outgoing quality (OQA) applications. The system boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite, the F30 System redefines inspection cost of ownership expectations. It has a throughput of up to 120 wph (10µm) and resolution flexibility (10µm to 0.5µm). It also has three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer. The F30 System is suitable for a variety of applications including After develop inspection (ADI), Fab Outgoing QA, Post CMP inspection, and After etch inspection. It can also team with edge and backside modules for an all-surface solution.ドキュメント
ドキュメントなし
カテゴリ
Defect Inspection
最終検証： 2日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
139950
ウェーハサイズ：
不明
ヴィンテージ：
2017
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / RUDOLPH / AUGUST
F30
カテゴリ
Defect Inspection
最終検証： 2日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
139950
ウェーハサイズ：
不明
ヴィンテージ：
2017
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
F30bOEMモデルの説明
The F30™ System is an advanced inspection tool designed to blur the lines between dark field micro inspection and traditional macro inspection. It provides automated defect inspection for front-end and outgoing quality (OQA) applications. The system boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite, the F30 System redefines inspection cost of ownership expectations. It has a throughput of up to 120 wph (10µm) and resolution flexibility (10µm to 0.5µm). It also has three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer. The F30 System is suitable for a variety of applications including After develop inspection (ADI), Fab Outgoing QA, Post CMP inspection, and After etch inspection. It can also team with edge and backside modules for an all-surface solution.ドキュメント
ドキュメントなし