説明
-Includes WHS (wafer handling station) -Installed and running構成
構成なしOEMモデルの説明
The NSX-100 is a high-throughput and repeatable macro defect inspection solution that is part of the NSX® Series. It is designed to detect macro defects (defects 0.5 micron and larger) that can occur during various stages of device manufacturing, such as wafer manufacturing, probing, bumping, dicing, or general handling. These defects can have a significant impact on the quality of microelectronic devices. The NSX-100 provides fast and consistent 2D bump inspection and valuable process information for enhanced process control and product consistency. This information can be transferred to Discover™, Rudolph’s yield management software, for further analysis and review. The NSX-100 is suitable for 200 mm applications and has time-tested applications in various markets, including semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS), and micro display markets. It offers automated, 100% advanced macro defect inspection to ensure quality assurance. NSX-100 series systems are able to inspect as many as 97 wafers-per-hour.ドキュメント
ドキュメントなし
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
130985
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / RUDOLPH / AUGUST
NSX-100
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
130985
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
-Includes WHS (wafer handling station) -Installed and running構成
構成なしOEMモデルの説明
The NSX-100 is a high-throughput and repeatable macro defect inspection solution that is part of the NSX® Series. It is designed to detect macro defects (defects 0.5 micron and larger) that can occur during various stages of device manufacturing, such as wafer manufacturing, probing, bumping, dicing, or general handling. These defects can have a significant impact on the quality of microelectronic devices. The NSX-100 provides fast and consistent 2D bump inspection and valuable process information for enhanced process control and product consistency. This information can be transferred to Discover™, Rudolph’s yield management software, for further analysis and review. The NSX-100 is suitable for 200 mm applications and has time-tested applications in various markets, including semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS), and micro display markets. It offers automated, 100% advanced macro defect inspection to ensure quality assurance. NSX-100 series systems are able to inspect as many as 97 wafers-per-hour.ドキュメント
ドキュメントなし