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ONTO / RUDOLPH / AUGUST NSX-220
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    The NSX® 220 System is an automated macro defect inspection system designed for semiconductor, LED, and MEMS manufacturers. It offers cost-effective back-end macro defect inspection for wafers up to 300mm in size. The system uses gray-scale image analysis to provide fast, accurate inspection and metrology. It can detect traditional advanced macro defects and perform two-dimensional measurements on bumps, probe marks, and edge trim processes. The system features a flexible objective turret, a programmable light tower, a standard docking module, recipe sharing, and a 2D defect and metrology verification standard. It is ideal for manufacturers looking to optimize productivity and minimize the need for operator assistance.
    ドキュメント

    ドキュメントなし

    verified-listing-icon

    検証済み

    カテゴリ
    Defect Inspection

    最終検証: 11日前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    141848


    ウェーハサイズ:

    6"/150mm


    ヴィンテージ:

    不明


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    ONTO / RUDOLPH / AUGUST NSX-220

    ONTO / RUDOLPH / AUGUST

    NSX-220

    Defect Inspection
    ヴィンテージ: 0状態: 中古
    最終確認11日前

    ONTO / RUDOLPH / AUGUST

    NSX-220

    verified-listing-icon
    検証済み
    カテゴリ
    Defect Inspection
    最終検証: 11日前
    listing-photo-9deba6f0838e4ab3b31e093ff5c15703-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    141848


    ウェーハサイズ:

    6"/150mm


    ヴィンテージ:

    不明


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    The NSX® 220 System is an automated macro defect inspection system designed for semiconductor, LED, and MEMS manufacturers. It offers cost-effective back-end macro defect inspection for wafers up to 300mm in size. The system uses gray-scale image analysis to provide fast, accurate inspection and metrology. It can detect traditional advanced macro defects and perform two-dimensional measurements on bumps, probe marks, and edge trim processes. The system features a flexible objective turret, a programmable light tower, a standard docking module, recipe sharing, and a 2D defect and metrology verification standard. It is ideal for manufacturers looking to optimize productivity and minimize the need for operator assistance.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    ONTO / RUDOLPH / AUGUST NSX-220

    ONTO / RUDOLPH / AUGUST

    NSX-220

    Defect Inspectionヴィンテージ: 0状態: 中古最終検証:11日前