説明
Macro-Defect構成
構成なしOEMモデルの説明
The NSX 330 System is an advanced packaging system that improves cost of ownership by enabling multiple applications in a single platform. It combines inspection and metrology to measure multiple applications, including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load. The system offers robust platform technology and is suitable for a wide range of applications. It also offers a choice of inspection platforms with hard-anodized finish which can accommodate 100mm to 330mm whole wafers and features programmable light tower, programmable illumination filter wheel, multiple modes of dark field illumination, standard docking module, resolution flexibility (10µm to 0.5µm), three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer. It teams with edge and backside modules for all-surface solution and offers unique handling solutions (Mems, Taiko, Thin), extreme warpage (>12mm) and ultra-thin (<50µm). The system also supports tool matching, recipe sharing, recipe server, Discover® Software database results archiving, offline inspection and metrology engineering clients as well as offline defect review clients.ドキュメント
ドキュメントなし
ONTO / RUDOLPH / AUGUST
NSX-330
検証済み
カテゴリ
Defect Inspection
最終検証： 14日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
109165
ウェーハサイズ：
不明
ヴィンテージ：
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / RUDOLPH / AUGUST
NSX-330
カテゴリ
Defect Inspection
最終検証： 14日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
109165
ウェーハサイズ：
不明
ヴィンテージ：
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Macro-Defect構成
構成なしOEMモデルの説明
The NSX 330 System is an advanced packaging system that improves cost of ownership by enabling multiple applications in a single platform. It combines inspection and metrology to measure multiple applications, including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load. The system offers robust platform technology and is suitable for a wide range of applications. It also offers a choice of inspection platforms with hard-anodized finish which can accommodate 100mm to 330mm whole wafers and features programmable light tower, programmable illumination filter wheel, multiple modes of dark field illumination, standard docking module, resolution flexibility (10µm to 0.5µm), three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer. It teams with edge and backside modules for all-surface solution and offers unique handling solutions (Mems, Taiko, Thin), extreme warpage (>12mm) and ultra-thin (<50µm). The system also supports tool matching, recipe sharing, recipe server, Discover® Software database results archiving, offline inspection and metrology engineering clients as well as offline defect review clients.ドキュメント
ドキュメントなし