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ONTO / RUDOLPH / AUGUST NSX-95
  • ONTO / RUDOLPH / AUGUST NSX-95
  • ONTO / RUDOLPH / AUGUST NSX-95
  • ONTO / RUDOLPH / AUGUST NSX-95
  • ONTO / RUDOLPH / AUGUST NSX-95
説明
説明なし
構成
構成なし
OEMモデルの説明
The NSX-95 is an automated inspection system that provides fast and consistent 100% 2D bump inspection and 3D bump height inspection. It ensures the quality of every process step and provides process and defect information for enhanced process control and product consistency. The system also features YieldPilot enhanced data and defect analysis. It has proven applications in semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS) and micro display markets. The NSX-95 has a throughput of 43 wafers per hour for 12"/300mm wafers, 63 wafers per hour for 8"/200mm wafers, 76 wafers per hour for 6"/150mm wafers, 83 wafers per hour for 5"/150mm wafers, and 89 wafers per hour for 4"/100mm wafers.
ドキュメント

ドキュメントなし

カテゴリ
Defect Inspection

最終検証: 60日以上前

主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

60466


ウェーハサイズ:

不明


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示

ONTO / RUDOLPH / AUGUST

NSX-95

verified-listing-icon
検証済み
カテゴリ
Defect Inspection
最終検証: 60日以上前
listing-photo-b1b9e3c9dce54cf5ad83e61897b54e87-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/60466/933d095206c246b88536fc9d88154379_3ee715cd665e4f41945d3b4022903a53image43scaled_mw.jpeg
listing-photo-b1b9e3c9dce54cf5ad83e61897b54e87-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/60466/196255780e864db39f70577332149315_9004b973ff0143dd86562e8b8834f951image44scaled_mw.jpeg
listing-photo-b1b9e3c9dce54cf5ad83e61897b54e87-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/60466/9901397c3ab046c2a04f64bd6e39e4f5_4358c348067a4eb3a488b9e64cb8a8d7image45scaled_mw.jpeg
listing-photo-b1b9e3c9dce54cf5ad83e61897b54e87-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/60466/35a77d860210494eb6085aff292d2790_7f00e1fb289e4341a373012e022d291fimage46scaled_mw.jpeg
主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

60466


ウェーハサイズ:

不明


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし
構成
構成なし
OEMモデルの説明
The NSX-95 is an automated inspection system that provides fast and consistent 100% 2D bump inspection and 3D bump height inspection. It ensures the quality of every process step and provides process and defect information for enhanced process control and product consistency. The system also features YieldPilot enhanced data and defect analysis. It has proven applications in semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS) and micro display markets. The NSX-95 has a throughput of 43 wafers per hour for 12"/300mm wafers, 63 wafers per hour for 8"/200mm wafers, 76 wafers per hour for 6"/150mm wafers, 83 wafers per hour for 5"/150mm wafers, and 89 wafers per hour for 4"/100mm wafers.
ドキュメント

ドキュメントなし

同様のリスト
すべて表示