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説明
説明なし構成
構成なしOEMモデルの説明
AutoWafer is an ultrasonic wafer scanner for nondestructive testing (NDT) of wafers in development and production environments, providing high-resolution identification of bond defects in wafer applications such as MEMS, CMOS, memory, TSV and LED. Robotic cassette handling and sorting of approved and failed wafers helps speed production, while our advanced transducers and auto-analysis tools make it quick and easy to identify even the smallest, most subtle defects. -The ideal automatic ultrasonic testing system for detecting wafer-to-wafer bonding defects -A fully automated, production-ready wafer scanner for MEMS, CMOS, BSI sensors, memory, TSV, LED and other applications employing wafers 200mm and smaller -Provides wafer map with die-level pass/fail indicators (optional) -Provides analysis (optional) -200mm SECS/GEM -TSV entrenched metrologyドキュメント
ドキュメントなし
SONIX
AutoWafer
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
72971
ウェーハサイズ：
不明
ヴィンテージ：
不明
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説明
説明なし構成
構成なしOEMモデルの説明
AutoWafer is an ultrasonic wafer scanner for nondestructive testing (NDT) of wafers in development and production environments, providing high-resolution identification of bond defects in wafer applications such as MEMS, CMOS, memory, TSV and LED. Robotic cassette handling and sorting of approved and failed wafers helps speed production, while our advanced transducers and auto-analysis tools make it quick and easy to identify even the smallest, most subtle defects. -The ideal automatic ultrasonic testing system for detecting wafer-to-wafer bonding defects -A fully automated, production-ready wafer scanner for MEMS, CMOS, BSI sensors, memory, TSV, LED and other applications employing wafers 200mm and smaller -Provides wafer map with die-level pass/fail indicators (optional) -Provides analysis (optional) -200mm SECS/GEM -TSV entrenched metrologyドキュメント
ドキュメントなし