説明
Includes, 6” and 8” wafer Film frame expander changeover kits, alignment tools and full set of handbook.構成
構成なしOEMモデルの説明
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.ドキュメント
ドキュメントなし
ASM
AD898
検証済み
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 18日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
13138
ウェーハサイズ：
6"/150mm, 8"/200mm
ヴィンテージ：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
ASM
AD898
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 18日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
13138
ウェーハサイズ：
6"/150mm, 8"/200mm
ヴィンテージ：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Includes, 6” and 8” wafer Film frame expander changeover kits, alignment tools and full set of handbook.構成
構成なしOEMモデルの説明
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.ドキュメント
ドキュメントなし