説明
Die Bonder構成
ASM AD898CCOEMモデルの説明
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.ドキュメント
ドキュメントなし
ASM
AD898
検証済み
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
115804
ウェーハサイズ：
6"/150mm, 8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
ASM
AD898
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
115804
ウェーハサイズ：
6"/150mm, 8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Die Bonder構成
ASM AD898CCOEMモデルの説明
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.ドキュメント
ドキュメントなし