AD8912
概要(Overview)
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.
現在の掲載品
12
サービス
検査、保証、鑑定、ロジスティクス
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.
12
検査、保証、鑑定、ロジスティクス