説明
Die Bonder構成
Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil to 1000 x 1000 mil) Die Placement Accuracy XY (0.38 mil)8.38um Epoxy Fillet Height (<2/3 of die thickness) BLT typically 1 0.2mil die size (material dependent) Work holder Indexer (linear motor) Pick/Bond Head (Linear Motor) Qty. 2 Ejector System Wafer Handling System Vision System Dispensing system (Musashi Pump) Epoxy Writer System (Disposal Nozzle)OEMモデルの説明
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.ドキュメント
ドキュメントなし
ASM
AD8912
検証済み
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
72286
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
ASM
AD8912
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
72286
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Die Bonder構成
Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil to 1000 x 1000 mil) Die Placement Accuracy XY (0.38 mil)8.38um Epoxy Fillet Height (<2/3 of die thickness) BLT typically 1 0.2mil die size (material dependent) Work holder Indexer (linear motor) Pick/Bond Head (Linear Motor) Qty. 2 Ejector System Wafer Handling System Vision System Dispensing system (Musashi Pump) Epoxy Writer System (Disposal Nozzle)OEMモデルの説明
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.ドキュメント
ドキュメントなし