説明
Bonding Machine Chip Bonder, a high-precision multi-chip bonding system in fully functional condition. This integrated dispensing system supports multiple dispensing methods and epoxy resin processing. Maximum production efficiency reaches 7,000 wafers/hour, with flip chip bonding efficiency up to 2,500 wafers/hour. X/Y-axis positioning accuracy: ±7μm; θ-axis positioning accuracy: ±0.15°. An ideal choice for semiconductor chip packaging production. Supports multiple wafer handling methods, suitable for 2-inch to 12-inch wafers. Includes original computer and keyboard with a clear, intuitive operating interface.構成
構成なしOEMモデルの説明
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.ドキュメント
ドキュメントなし
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 11日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
140560
ウェーハサイズ：
2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm, 12"/300mm
ヴィンテージ：
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
BESI / DATACON
2200 EVO
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 11日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
140560
ウェーハサイズ：
2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm, 12"/300mm
ヴィンテージ：
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Bonding Machine Chip Bonder, a high-precision multi-chip bonding system in fully functional condition. This integrated dispensing system supports multiple dispensing methods and epoxy resin processing. Maximum production efficiency reaches 7,000 wafers/hour, with flip chip bonding efficiency up to 2,500 wafers/hour. X/Y-axis positioning accuracy: ±7μm; θ-axis positioning accuracy: ±0.15°. An ideal choice for semiconductor chip packaging production. Supports multiple wafer handling methods, suitable for 2-inch to 12-inch wafers. Includes original computer and keyboard with a clear, intuitive operating interface.構成
構成なしOEMモデルの説明
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.ドキュメント
ドキュメントなし