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TRESKY 3002/3102
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer Die Bonder
    ドキュメント

    ドキュメントなし

    TRESKY

    3002/3102

    verified-listing-icon

    検証済み

    カテゴリ
    Die Bonders / Sorters / Attachers

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    16458


    ウェーハサイズ:

    8"/200mm


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / Attachers
    ヴィンテージ: 0状態: 中古
    最終確認60日以上前

    TRESKY

    3002/3102

    verified-listing-icon
    検証済み
    カテゴリ
    Die Bonders / Sorters / Attachers
    最終検証: 60日以上前
    listing-photo-FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/HIRFC8l_oK7h5mJJleGYJLwHwS9yUMInpxob19BPZSA/FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo/XAQwjaY1Ybp10Xm_TYbFwgwBe3mzWkB4ARqcQT03-6c_20200316_115514_f
    listing-photo-FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/HIRFC8l_oK7h5mJJleGYJLwHwS9yUMInpxob19BPZSA/FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo/Z8s9Hr7WYtuliFsQ9JZOFFnv5TANAEdACfITp3pmE9s_20200316_115514_f
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    16458


    ウェーハサイズ:

    8"/200mm


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer Die Bonder
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / Attachersヴィンテージ: 0状態: 中古最終検証:60日以上前
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / Attachersヴィンテージ: 0状態: 中古最終検証:60日以上前
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / Attachersヴィンテージ: 0状態: 中古最終検証:60日以上前