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TRESKY 3002/3102
  • TRESKY 3002/3102
  • TRESKY 3002/3102
説明
説明なし
構成
構成なし
OEMモデルの説明
The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer Die Bonder
ドキュメント

ドキュメントなし

verified-listing-icon

検証済み

カテゴリ
Die Bonders / Sorters / Attachers

最終検証: 60日以上前

主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

21017


ウェーハサイズ:

不明


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

TRESKY

3002/3102

verified-listing-icon
検証済み
カテゴリ
Die Bonders / Sorters / Attachers
最終検証: 60日以上前
listing-photo-sdAChwslF_vSWaaqIkXmC8vpRkR9F_3v_U_lDyNbGMs-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/HIRFC8l_oK7h5mJJleGYJLwHwS9yUMInpxob19BPZSA/sdAChwslF_vSWaaqIkXmC8vpRkR9F_3v_U_lDyNbGMs/On7Gd3QHSgGvcDv1iTntKlLVoU0zxa9Kky21YJTu3VI_20200316_115641_f
listing-photo-sdAChwslF_vSWaaqIkXmC8vpRkR9F_3v_U_lDyNbGMs-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/HIRFC8l_oK7h5mJJleGYJLwHwS9yUMInpxob19BPZSA/sdAChwslF_vSWaaqIkXmC8vpRkR9F_3v_U_lDyNbGMs/k77AyJKgf0rDLeRh7J6NmPt3ZvdRLcZ6C2heJYWuRiM_20200316_115641_f
主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

21017


ウェーハサイズ:

不明


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし
構成
構成なし
OEMモデルの説明
The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer Die Bonder
ドキュメント

ドキュメントなし