説明
Vintage: 2018 Status: Installed and running Condition: Complete and working. No missing parts. Availability: Immediate release構成
Wafer Size: 150mm Process: ICP (Chlorine etch) Chamber Type: x3 DTM Etch (Cl) chambers Chamber Body Type: DPS Chamber Process: Metal Etch Load Lock / Cassette Configuration: 6" Peek Robot: Blade 6" & 8" Robot w/window Pump: Pump Turbo, Heater, STP-A1603C, Seiko Keiki Type: B75100030OEMモデルの説明
"This single-wafer, multi-chamber machine processes 5”, 6”, or 8” wafers for ≤200mm fabrication. Applications include: epitaxy, etch, CVD, plasma nitridation, and RTP. AMAT’s CENTURA II can accommodate up to 4 process chambers and 2 auxiliary chambers. Configuration includes load lock chambers, wafer handler robot, transfer wafer, process chambers, pneumatic panel, orientation chambergas panel, and cool down chamber. Centura II is compatible with numerous auxiliary chamber types including: Lamp Heated CVD, PE TEOS DxZ, PE Silane DxZ, Gigafill SACVD, Ultima HDP-CVD, Ultima+ HDP-CVD, Ultima tE HDP-CVD, Tungsten WxZ, ALD Tungsten, WxP Tungsten Etch (HeWeb), Tectra Titanium, Tectra Tinitride, ALD Tinitride, Reactive Preclean+, Metal Etch DPS/(+), Poly Etch DPS/(+), Poly Etch Deep Trench (DT), ASP/(+), Oxide Super-E , Oxide eMxP+, Oxide MxP+, Oxide eMax, IPS Dielectric Etch, Poly Etch MxP, Poly Etch MxP+, R2 Metal Etch, Metal Etch MxP, Mark II Etch, Orienter, and various cool down chamber mechanisms."ドキュメント
ドキュメントなし
カテゴリ
Dry / Plasma Etch
最終検証： 3日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Installed / Running
製品ID：
125355
ウェーハサイズ：
6"/150mm
ヴィンテージ：
2018
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
APPLIED MATERIALS (AMAT)
CENTURA II
カテゴリ
Dry / Plasma Etch
最終検証： 3日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Installed / Running
製品ID：
125355
ウェーハサイズ：
6"/150mm
ヴィンテージ：
2018
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Vintage: 2018 Status: Installed and running Condition: Complete and working. No missing parts. Availability: Immediate release構成
Wafer Size: 150mm Process: ICP (Chlorine etch) Chamber Type: x3 DTM Etch (Cl) chambers Chamber Body Type: DPS Chamber Process: Metal Etch Load Lock / Cassette Configuration: 6" Peek Robot: Blade 6" & 8" Robot w/window Pump: Pump Turbo, Heater, STP-A1603C, Seiko Keiki Type: B75100030OEMモデルの説明
"This single-wafer, multi-chamber machine processes 5”, 6”, or 8” wafers for ≤200mm fabrication. Applications include: epitaxy, etch, CVD, plasma nitridation, and RTP. AMAT’s CENTURA II can accommodate up to 4 process chambers and 2 auxiliary chambers. Configuration includes load lock chambers, wafer handler robot, transfer wafer, process chambers, pneumatic panel, orientation chambergas panel, and cool down chamber. Centura II is compatible with numerous auxiliary chamber types including: Lamp Heated CVD, PE TEOS DxZ, PE Silane DxZ, Gigafill SACVD, Ultima HDP-CVD, Ultima+ HDP-CVD, Ultima tE HDP-CVD, Tungsten WxZ, ALD Tungsten, WxP Tungsten Etch (HeWeb), Tectra Titanium, Tectra Tinitride, ALD Tinitride, Reactive Preclean+, Metal Etch DPS/(+), Poly Etch DPS/(+), Poly Etch Deep Trench (DT), ASP/(+), Oxide Super-E , Oxide eMxP+, Oxide MxP+, Oxide eMax, IPS Dielectric Etch, Poly Etch MxP, Poly Etch MxP+, R2 Metal Etch, Metal Etch MxP, Mark II Etch, Orienter, and various cool down chamber mechanisms."ドキュメント
ドキュメントなし