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APPLIED MATERIALS (AMAT) CENTURA Silvia Etch
    説明
    説明なし
    構成
    Silvia 2ch / Axiom 1ch
    OEMモデルの説明
    Applied Materials Centura Silvia Etch system is specifically designed for the challenging deep silicon etch required to create the vertical connections between the chips or wafers. It overcomes the tradeoff between profile control and high etch rate faced by conventional methods. The system’s high-density plasma source enables the highest silicon and oxide etch rates for all wafer-level packaging applications.
    ドキュメント

    ドキュメントなし

    APPLIED MATERIALS (AMAT)

    CENTURA Silvia Etch

    verified-listing-icon

    検証済み

    カテゴリ
    Dry / Plasma Etch

    最終検証: 昨日

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    117022


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    2010


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    APPLIED MATERIALS (AMAT) CENTURA Silvia Etch

    APPLIED MATERIALS (AMAT)

    CENTURA Silvia Etch

    Dry / Plasma Etch
    ヴィンテージ: 2010状態: 中古
    最終確認60日以上前

    APPLIED MATERIALS (AMAT)

    CENTURA Silvia Etch

    verified-listing-icon
    検証済み
    カテゴリ
    Dry / Plasma Etch
    最終検証: 昨日
    listing-photo-0ace2bbe871a4504bc76f00cbf9cbea4-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    117022


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    2010


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    Silvia 2ch / Axiom 1ch
    OEMモデルの説明
    Applied Materials Centura Silvia Etch system is specifically designed for the challenging deep silicon etch required to create the vertical connections between the chips or wafers. It overcomes the tradeoff between profile control and high etch rate faced by conventional methods. The system’s high-density plasma source enables the highest silicon and oxide etch rates for all wafer-level packaging applications.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    APPLIED MATERIALS (AMAT) CENTURA Silvia Etch

    APPLIED MATERIALS (AMAT)

    CENTURA Silvia Etch

    Dry / Plasma Etchヴィンテージ: 2010状態: 中古最終検証:60日以上前
    APPLIED MATERIALS (AMAT) CENTURA Silvia Etch

    APPLIED MATERIALS (AMAT)

    CENTURA Silvia Etch

    Dry / Plasma Etchヴィンテージ: 2010状態: 中古最終検証:昨日