説明
ETCH構成
3C/HOEMモデルの説明
Applied Materials Centura Silvia Etch system is specifically designed for the challenging deep silicon etch required to create the vertical connections between the chips or wafers. It overcomes the tradeoff between profile control and high etch rate faced by conventional methods. The system’s high-density plasma source enables the highest silicon and oxide etch rates for all wafer-level packaging applications.ドキュメント
ドキュメントなし
APPLIED MATERIALS (AMAT)
CENTURA Silvia Etch
検証済み
カテゴリ
Dry / Plasma Etch
最終検証： 16日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
75693
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA Silvia Etch
カテゴリ
Dry / Plasma Etch
最終検証： 16日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
75693
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
ETCH構成
3C/HOEMモデルの説明
Applied Materials Centura Silvia Etch system is specifically designed for the challenging deep silicon etch required to create the vertical connections between the chips or wafers. It overcomes the tradeoff between profile control and high etch rate faced by conventional methods. The system’s high-density plasma source enables the highest silicon and oxide etch rates for all wafer-level packaging applications.ドキュメント
ドキュメントなし