説明

Wafer size : 6inch Wafer Type : JMF Heater Type : P-chuck Chamber Type : DLH Process Type : TEOS Ⅲ. Missing Part List controller box#1 -SBC SEI VI DEO DI /O#3 DI /O#4 controller box#2 - +15V PS AI MUX OPTO#1 Mainframe Top - Storage El evat or mot or TM robot blade TM robot lower home sensor Chamber A - C. M gauge Throttle valve

構成

構成なし

OEMモデルの説明

The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.