説明

METAL ETCH Details Attached

構成

METAL ETCH Wafer Shape SNNF, 25 Slot Loadlock Standard Cassette Loadlock Buffer Chamber Robot Standard Storage(29 SLOT) & Robot Position A PROCESS CHAMBER(Metal ETCH, M-CHUCK) Position B None Position C None Position D PR STRIP CHAMBER (Standard) Line Frequency 50/60 Hz Line Voltage 208V / 250 Amp / 5Wires(R,S,T,N,G) N2 Vent SST Flared Facilities water in Mainframe YES Software Revision Unknown Monitor NONE Mini SBC B/D MISSING HDD and FDD P-5000 Standard UPS Interface NO Automatic Interface SECS-Ⅰ, Ⅱ, GEM Interlock option EMO Generator Cooling Water Cooling Power cable and signal cable 50FT Heat Exchanger type AMAT-0 Standard Heatexchanger Heat Exchanger cable 50FT Monitor Quantity None Monitor 1 None Color None Buffer (1ea) None Process (3ea) None Turbo Pump YES (CH A) Turbo Pump Controller YES (1 EA) Process (1ea) None Position A & B Clamp on Cassette Clamp Slot 25 Center find Yes Slot 29 Buffer Type Standard Load lock Vent Type Slow & Fast load lock venting & diffuser Load lock pumping Type Fast load lock pumping Fast Mapping None Wafer Detector Blade Cap & Vac sensor Pump Interface YES Slit Valve Standard Gas feed Top Filters MILLIPORE / PALL or Other. Pneumatic valves in gas lines Nupro/ Veriflo Chamber pressure gauge MKS 10Torr Chamber foreline TC gauge Varian or Other Process gas 1 BLC3, MFC range 200sccm : Unit 1660 or Higher Process gas 2 N2, MFC range 100sccm : Unit 1660 or Higher Process gas 3 SF6, MFC range 200sccm : Unit 1660 or Higher Process gas 4 CL2, MFC range 100sccm : Unit 1660 or Higher Process gas 5 Ar, MFC range 200sccm : Unit 1660 or Higher Process gas 6 O2, MFC range 5000sccm : Unit 1660 or Higher ChA RF generator ENI OEM-6 ChB RF generator None ChC RF generator None ChD RF generator ASTEX AX2115 RF match type MISSING System heat exchanger AMAT 0 DI tank in Heat exchanger AS-IS System Neslab None System local monitor None System remote monitor None HX water hose None Pump cables None Remote control cables 50 FT Process kits AS-IS Platform O-ring AS-IS Process chamber O-ring type AS-IS Slit valve O-ring type AS-IS Lift assembly AS-IS Susceptor lift assembly AS-IS Transfer Robot AS-IS Slit valve cylinder AS-IS Wafer lift bellows AS-IS Suceptor lift bellows AS-IS Robot blade 6 inch Throttle valve(Dual spring type) AS-IS Belts in throttle valves AS-IS Mainframe EV Panel AS-IS Gas panel EV panel AS-IS Hard disk in VME HDD type All consumable parts in system AS-IS

OEMモデルの説明

The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.