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HITACHI HS-9050
    説明
    The 2019 Hitachi High-Technologies Dry Etch / Plasma Asher is engineered for precision processing, optimizing etching and ashing capabilities in semiconductor applications. Its advanced technology ensures uniformity and high throughput, making it ideal for both production and research settings. This equipment is designed to meet stringent industry standards, providing reliability and enhanced performance in the manufacturing process. The
    構成
    Retronix Semiconductor is pleased to present a 2019 Hitachi High-Technologies HS 9050 Dry Etch / Plasma Asher, configured for high-current operation (150A, 3Ø AC 208V). This 12” multi-chamber platform comprises: Five Asher / Etch chambers Two Cooling chambers Integrated transfer modules Mini-Environment Wafer Loading Module (EFEM) The system is configured for copper processing. HDD has been removed and no software is included. This is a modern, high-performance platform suited to facilities seeking reliable dry etch capability without extended OEM lead times.
    OEMモデルの説明
    HS-9050 is equipped with a gas system compatible with both organic and inorganic films. Processing can be flexibly set based on the structure of the film layers, enabling the entire removal process of multilayer resists in next-generation devices to be performed within the same chamber. Meanwhile, helical downflow plasma has been newly adopted as the plasma source, resulting in a highly efficient, less damaging process.
    ドキュメント
    verified-listing-icon

    検証済み

    カテゴリ
    Dry / Plasma Etch

    最終検証: 今日

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    Deinstalled / Palletized


    製品ID:

    143434


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2019


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    HITACHI HS-9050

    HITACHI

    HS-9050

    Dry / Plasma Etch
    ヴィンテージ: 2019状態: 中古
    最終確認今日

    HITACHI

    HS-9050

    verified-listing-icon
    検証済み
    カテゴリ
    Dry / Plasma Etch
    最終検証: 今日
    listing-photo-4e2813579ec14e89b21bf74c32067966-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/91070/143434/f67482056192428387932f4955cb83ee_19a89014dac144409d1bc96bc873bbd3e2_mw.png
    listing-photo-4e2813579ec14e89b21bf74c32067966-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/91070/143434/0d37d87b6c764b7faf08a835f4c49322_ca2ed377f8494c6d91f0885eb74b57a2edit3_mw.png
    listing-photo-4e2813579ec14e89b21bf74c32067966-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/91070/143434/02bc3015c7794ce1b810525f36b4e47f_3253430e288b4ad988edba3aefeb8259edit4_mw.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    Deinstalled / Palletized


    製品ID:

    143434


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2019


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    The 2019 Hitachi High-Technologies Dry Etch / Plasma Asher is engineered for precision processing, optimizing etching and ashing capabilities in semiconductor applications. Its advanced technology ensures uniformity and high throughput, making it ideal for both production and research settings. This equipment is designed to meet stringent industry standards, providing reliability and enhanced performance in the manufacturing process. The
    構成
    Retronix Semiconductor is pleased to present a 2019 Hitachi High-Technologies HS 9050 Dry Etch / Plasma Asher, configured for high-current operation (150A, 3Ø AC 208V). This 12” multi-chamber platform comprises: Five Asher / Etch chambers Two Cooling chambers Integrated transfer modules Mini-Environment Wafer Loading Module (EFEM) The system is configured for copper processing. HDD has been removed and no software is included. This is a modern, high-performance platform suited to facilities seeking reliable dry etch capability without extended OEM lead times.
    OEMモデルの説明
    HS-9050 is equipped with a gas system compatible with both organic and inorganic films. Processing can be flexibly set based on the structure of the film layers, enabling the entire removal process of multilayer resists in next-generation devices to be performed within the same chamber. Meanwhile, helical downflow plasma has been newly adopted as the plasma source, resulting in a highly efficient, less damaging process.
    ドキュメント
    同様のリスト
    すべて表示
    HITACHI HS-9050

    HITACHI

    HS-9050

    Dry / Plasma Etchヴィンテージ: 2019状態: 中古最終検証:今日
    HITACHI HS-9050

    HITACHI

    HS-9050

    Dry / Plasma Etchヴィンテージ: 2019状態: 中古最終検証:60日以上前
    HITACHI HS-9050

    HITACHI

    HS-9050

    Dry / Plasma Etchヴィンテージ: 2019状態: 中古最終検証:60日以上前