説明
Dielectric Etch構成
Tool Status: Chamber has been shut down and deinstalled and moved to the warehouse. Configuration. Audit to verify. LAM FXP Chamber only with RF unit and gas box.OEMモデルの説明
The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.ドキュメント
ドキュメントなし
LAM RESEARCH CORPORATION
2300 EXELAN FLEX
検証済み
カテゴリ
Dry / Plasma Etch
最終検証： 6日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
23058
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
LAM RESEARCH CORPORATION
2300 EXELAN FLEX
カテゴリ
Dry / Plasma Etch
最終検証： 6日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
23058
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Dielectric Etch構成
Tool Status: Chamber has been shut down and deinstalled and moved to the warehouse. Configuration. Audit to verify. LAM FXP Chamber only with RF unit and gas box.OEMモデルの説明
The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.ドキュメント
ドキュメントなし