説明
TEL TACTRAS with VIGUS Ix BSP Chambers Excluded Items: -ESC High Voltage (4) -DC Power Supply -SE2K Endpoint Detection Computer (1) -Electrostatic Chucks(ESC) (4)構成
Handler System: Loader Module YASKAWA Model NXC100 NLM W/S (1) Options System: Nitrogen Purge Storage w/ Controller (1) Main System: VIGUS Ix BSP Chamber (4) Factory Interface: FOUP (3) Software Version: Ver. 6.80 CIM: GEM Process: MHM TrenchOEMモデルの説明
Tactras™ is a 300mm plasma etch system that enhances etch process productivity. It provides customized solutions for high aspect ratio holes, trench etch, mask and dielectric etch, and BEOL dielectric etch. The common base product design allows Tactras™ to be built for specific applications. The etch chambers that can be installed on Tactras™ employ optimal design technologies to achieve excellent within-wafer uniformity, low wafer-to-wafer variation, and high selectivity in shaping the etch profile. Up to 6 chambers can be installed on Tactras™, each capable of handling different etch applications as required. Tactras™ offers operational advantages enabled by TEL’s cumulative knowhow on production technology, including a robust design to minimize machine-to-machine and chamber-to-chamber variation, particle reduction technology, unit-assembly inspection, and labor-saving automation. All of these contribute to customers’ productivity.ドキュメント
ドキュメントなし
カテゴリ
Dry / Plasma Etch
最終検証： 11日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
146873
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
TEL / TOKYO ELECTRON
TACTRAS
カテゴリ
Dry / Plasma Etch
最終検証： 11日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
146873
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
TEL TACTRAS with VIGUS Ix BSP Chambers Excluded Items: -ESC High Voltage (4) -DC Power Supply -SE2K Endpoint Detection Computer (1) -Electrostatic Chucks(ESC) (4)構成
Handler System: Loader Module YASKAWA Model NXC100 NLM W/S (1) Options System: Nitrogen Purge Storage w/ Controller (1) Main System: VIGUS Ix BSP Chamber (4) Factory Interface: FOUP (3) Software Version: Ver. 6.80 CIM: GEM Process: MHM TrenchOEMモデルの説明
Tactras™ is a 300mm plasma etch system that enhances etch process productivity. It provides customized solutions for high aspect ratio holes, trench etch, mask and dielectric etch, and BEOL dielectric etch. The common base product design allows Tactras™ to be built for specific applications. The etch chambers that can be installed on Tactras™ employ optimal design technologies to achieve excellent within-wafer uniformity, low wafer-to-wafer variation, and high selectivity in shaping the etch profile. Up to 6 chambers can be installed on Tactras™, each capable of handling different etch applications as required. Tactras™ offers operational advantages enabled by TEL’s cumulative knowhow on production technology, including a robust design to minimize machine-to-machine and chamber-to-chamber variation, particle reduction technology, unit-assembly inspection, and labor-saving automation. All of these contribute to customers’ productivity.ドキュメント
ドキュメントなし