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説明
Amicra Die-Bonder構成
構成なしOEMモデルの説明
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-controlドキュメント
ドキュメントなし
PREFERRED
SELLER
カテゴリ
Flip Chip Bonders
最終検証： 23日前
Buyer pays 12% premium of final sale price
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
124492
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
ASMPT
AMICRA NOVA PLUS
カテゴリ
Flip Chip Bonders
最終検証： 23日前
Buyer pays 12% premium of final sale price
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
124492
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Amicra Die-Bonder構成
構成なしOEMモデルの説明
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-controlドキュメント
ドキュメントなし