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AVIZA / SVG / THERMCO RVP-300plus
    説明
    説明なし
    構成
    DIFF
    OEMモデルの説明
    For high volume manufacturing for up to 300-mm wafers at 90 nm with extendibility to 65 nm. RVP-300plus is designed for processing 300mm wafers addressing requirements for 0.13-micron and smaller geometries. The design of the RVP-300plus focuses on maximizing productivity and throughput. Among its features, the RVP-300plus is capable of rapidly ramping the temperature up and down, which results in chemical deposition and temperature control across the wafer. The RVP-300plus also utilizes a dual-cassette configuration resulting in increased throughput.
    ドキュメント

    ドキュメントなし

    AVIZA / SVG / THERMCO

    RVP-300plus

    verified-listing-icon

    検証済み

    カテゴリ
    Furnaces / Diffusion

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    107409


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    AVIZA / SVG / THERMCO RVP-300plus

    AVIZA / SVG / THERMCO

    RVP-300plus

    Furnaces / Diffusion
    ヴィンテージ: 2005状態: 中古
    最終確認60日以上前

    AVIZA / SVG / THERMCO

    RVP-300plus

    verified-listing-icon
    検証済み
    カテゴリ
    Furnaces / Diffusion
    最終検証: 60日以上前
    listing-photo-afe45104fc5e406899b0b1f0ad8447ad-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    107409


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    DIFF
    OEMモデルの説明
    For high volume manufacturing for up to 300-mm wafers at 90 nm with extendibility to 65 nm. RVP-300plus is designed for processing 300mm wafers addressing requirements for 0.13-micron and smaller geometries. The design of the RVP-300plus focuses on maximizing productivity and throughput. Among its features, the RVP-300plus is capable of rapidly ramping the temperature up and down, which results in chemical deposition and temperature control across the wafer. The RVP-300plus also utilizes a dual-cassette configuration resulting in increased throughput.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    AVIZA / SVG / THERMCO RVP-300plus

    AVIZA / SVG / THERMCO

    RVP-300plus

    Furnaces / Diffusionヴィンテージ: 2005状態: 中古最終検証:60日以上前
    AVIZA / SVG / THERMCO RVP-300plus

    AVIZA / SVG / THERMCO

    RVP-300plus

    Furnaces / Diffusionヴィンテージ: 2006状態: 中古最終検証:60日以上前