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説明
説明なし構成
DIFFOEMモデルの説明
For high volume manufacturing for up to 300-mm wafers at 90 nm with extendibility to 65 nm. RVP-300plus is designed for processing 300mm wafers addressing requirements for 0.13-micron and smaller geometries. The design of the RVP-300plus focuses on maximizing productivity and throughput. Among its features, the RVP-300plus is capable of rapidly ramping the temperature up and down, which results in chemical deposition and temperature control across the wafer. The RVP-300plus also utilizes a dual-cassette configuration resulting in increased throughput.ドキュメント
ドキュメントなし
カテゴリ
Furnaces / Diffusion
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
107409
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
AVIZA / SVG / THERMCO
RVP-300plus
カテゴリ
Furnaces / Diffusion
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
107409
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
DIFFOEMモデルの説明
For high volume manufacturing for up to 300-mm wafers at 90 nm with extendibility to 65 nm. RVP-300plus is designed for processing 300mm wafers addressing requirements for 0.13-micron and smaller geometries. The design of the RVP-300plus focuses on maximizing productivity and throughput. Among its features, the RVP-300plus is capable of rapidly ramping the temperature up and down, which results in chemical deposition and temperature control across the wafer. The RVP-300plus also utilizes a dual-cassette configuration resulting in increased throughput.ドキュメント
ドキュメントなし