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SCIENTIFIC SEALING TECHNOLOGY / SST 3130
  • SCIENTIFIC SEALING TECHNOLOGY / SST 3130
  • SCIENTIFIC SEALING TECHNOLOGY / SST 3130
  • SCIENTIFIC SEALING TECHNOLOGY / SST 3130
説明
500 DEG C, REBUILT VALVES AND VACUUM PUMP VACUUM BELOW 50 MILLITORR PRESSURES EXCEEDING 50 PSI
構成
構成なし
OEMモデルの説明
The Model 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Process profiles are easily created, and the process data can be analyzed off-line. The system is used in both production and research environments for flux-free soldering, brazing, annealing and glass sealing of components and packages for microelectronic applications.
ドキュメント

ドキュメントなし

PREFERRED
 
SELLER
カテゴリ
Furnaces / Diffusion

最終検証: 30日以上前

Buyer pays 12% premium of final sale price
主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

124174


ウェーハサイズ:

不明


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

SCIENTIFIC SEALING TECHNOLOGY / SST

3130

verified-listing-icon
検証済み
カテゴリ
Furnaces / Diffusion
最終検証: 30日以上前
listing-photo-25ba13e00d9c41fb8e3da34fff179d32-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Buyer pays 12% premium of final sale price
主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

124174


ウェーハサイズ:

不明


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
500 DEG C, REBUILT VALVES AND VACUUM PUMP VACUUM BELOW 50 MILLITORR PRESSURES EXCEEDING 50 PSI
構成
構成なし
OEMモデルの説明
The Model 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Process profiles are easily created, and the process data can be analyzed off-line. The system is used in both production and research environments for flux-free soldering, brazing, annealing and glass sealing of components and packages for microelectronic applications.
ドキュメント

ドキュメントなし