TEL / TOKYO ELECTRON

UL 257040

ALPHA 805D

TELFORMULA ALD HIGH-K

303H

A803 

UL 2604-10H

TELINDY PLUS ALD

UL 2604 08 HS

VMM-56-201

UL 2604-08H

VDF 610S

ALPHA-8SE™ i is a vertical batch thermal processing system for 200mm wafers. Released in 2018 by remodeling its predecessor ALPHA-8SE™ under the three concepts of innovation, inherit, and evolution, ALPHA-8SE™ i has received high acclaim for its stability and productivity.

ALPHA 8SEi

RLSA-H

TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry. 

TELFORMULA

The Alpha-303i is a 300mm production tool developed by Tokyo Electron. It is the result of years of research and development, with TEL having completed their 300mm batch furnace prototype in 1995. Since then, TEL has delivered numerous atmospheric and LP CVD systems to multiple customer sites and consortia worldwide. The Alpha-303i includes key features such as a 100 product wafer load size, a high-speed multiple-wafer loading system with optical notch alignment, and a Front-Opening Unified Pod (FOUP) interface that is configurable for overhead transfer systems (OHT) and personal guided vehicles (PGV). Additionally, boat rotation is standard on all processes, and a Fast Thermal Processing System (FTP) is available for both atmospheric and CVD systems. This tool reinforces TEL’s commitment to being production ready for the 300mm era of semiconductor manufacturing.

ALPHA(α)-303i

The ALPHA-8S is a popular batch thermal processing system for silicon wafers up to 200mm in size. It has been continuously improved to maximize efficiency and productivity, setting the standard for vertical furnaces. The system is versatile, supporting a wide range of process applications such as Wet/Dry Oxidation, Anneal, and LPCVD of Si, Si3N4, and SiO2. Additionally, various types of Up Grade Kits (UGK) are available to enhance productivity and extend the product’s life, including a GUI controller and other options

ALPHA-8S

TELINDY PLUS™ is a cutting-edge thermal processing technology that combines the best features of the TELFORMULA™ minibatch system and the previous generation TELINDY™ platform. It offers improved process performance and productivity, with new enhancements such as improved maintenance access, dry gas chamber cleaning, and low O2 environment loading area control. These features contribute to yield increases by managing small particles more effectively. The highest levels of productivity are achieved by combining a 125 wafer load size with TEL’s FTPS™ responsive heater and a dual boat system option. TELINDY PLUS™ can be used for a wide range of applications, from traditional silicon treatments to leading edge ALD processes and radical oxidation. It represents the convergence of demonstrated experience and advanced technology, making it a powerful tool for thermal processing.

TELINDY PLUS

Alpha-8 is a first-generation Alpha furnace designed for processing 200mm wafers in a vertical orientation. This furnace is capable of handling a wide range of semiconductor processing applications, including oxidation, diffusion, and annealing. Its vertical design allows for efficient use of space and improved temperature uniformity across the wafer.

ALPHA 8

The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.

TELINDY

The Alpha-8SE is a batch thermal processing system that covers multiple applications over a wide temperature range. It was introduced for 200mm wafer processing in the mid-1990s and has undergone continuous improvements to productivity, reliability, and stability. The Alpha-8SE supports 100/150/200mm wafer sizes and up to 150 wafer batch size for semiconductor thin film applications including oxidation & anneal, LPCVD of Si (Poly, a-Si), Si3N4, SiO2, and high-k ALD. It enables performance for today’s most advanced diffusion and deposition processes such as ALD (Atomic Layer Deposition), low-pressure radical oxidation, and low-temperature nitrides.

ALPHA-8SE

ALPHA IW-6D

IW-6

IW 6C

ALPHA 805C

TEL / TOKYO ELECTRON ALPHA 8SE-E is a Diffusion and Oxidation Furnaces system. The ALPHA 8SE-E can produce wafer size of 6”.

ALPHA 8SE-E

TELINDY PLUS™ IRad™ is the definitive intersection between thermal large-batch and plasma processing. TELINDY PLUS™ IRad™ maintains all of the design advantages of the field proven, high productivity and reliable TELINDY PLUS™ platform while incorporating a damage-free plasma capability. Thus, the TELINDY PLUS™ IRad™ further extends the process domain of batch technology to new, lower temperature regimes while maintaining deposited film quality. TELINDY PLUS™ IRad™ provides a stable platform for high quality thin film deposition at low temperature which is increasingly desired for advanced device scaling and dense 3D structures. Predominant applications include ultra-low temperature ALD Si3N4 and SiO2. With the included dry gas cleaning capability, both down time reduction and superior particle performance are realized.

TEL / TOKYO ELECTRON

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A803

UL 2604-10H

ALPHA 805D

ALPHA 8SEi

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