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説明
Improve processing stability and achieve higher productivity efficiency Dgp8761 is an improved model of dgp8760 with outstanding global sales performance. The machine realizes the integration of back grinding and residual stress removal technology, and can stably realize the thin machining with thickness less than 25 μ M. The newly developed spindle is also equipped, which is suitable for high-speed grinding and machining. It helps to shorten the processing time of thin wafer (compared with dgp8760). In addition, the reasonable layout of the handling mechanism shortens the production time beyond the processing. Various application of the third spindle The third spindle application for wafer machining includes the following Remove residual stress ● environmental protection, no "dry polishing" with liquid medicine or water ● CMP (special option) Ultra precision grinding (special option) Poligrind ●UltraPoligrind構成
構成なしOEMモデルの説明
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.ドキュメント
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DISCO
DGP8761
カテゴリ
Lapping, Polishing, Grinding
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
112258
ウェーハサイズ：
不明
ヴィンテージ：
不明
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説明
Improve processing stability and achieve higher productivity efficiency Dgp8761 is an improved model of dgp8760 with outstanding global sales performance. The machine realizes the integration of back grinding and residual stress removal technology, and can stably realize the thin machining with thickness less than 25 μ M. The newly developed spindle is also equipped, which is suitable for high-speed grinding and machining. It helps to shorten the processing time of thin wafer (compared with dgp8760). In addition, the reasonable layout of the handling mechanism shortens the production time beyond the processing. Various application of the third spindle The third spindle application for wafer machining includes the following Remove residual stress ● environmental protection, no "dry polishing" with liquid medicine or water ● CMP (special option) Ultra precision grinding (special option) Poligrind ●UltraPoligrind構成
構成なしOEMモデルの説明
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.ドキュメント
ドキュメントなし