説明
Process: Back Grinder構成
DGP8761+DFM2800OEMモデルの説明
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.ドキュメント
ドキュメントなし
DISCO
DGP8761
検証済み
カテゴリ
Lapping, Polishing, Grinding
最終検証: 30日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
114877
ウェーハサイズ:
不明
ヴィンテージ:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示DISCO
DGP8761
カテゴリ
Lapping, Polishing, Grinding
最終検証: 30日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
114877
ウェーハサイズ:
不明
ヴィンテージ:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Process: Back Grinder構成
DGP8761+DFM2800OEMモデルの説明
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.ドキュメント
ドキュメントなし