説明
説明なし構成
HT-SEM MonitoringOEMモデルの説明
The PROVision 3E system combines nanometer resolution, high speed, and through-layer imaging to produce the millions of datapoints needed to correctly pattern today’s most advanced designs, including 3nm foundry-logic chips, GAA transistors, and next-generation DRAM and 3D NAND. With these capabilities, it sees beyond the blind spots of optical metrology, performing accurate measurements across the wafer and between the many layers of a chip to generate the multidimensional data sets needed to achieve the best chip performance and accelerate time to market.ドキュメント
ドキュメントなし
カテゴリ
Metrology
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
129806
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
PROVision
カテゴリ
Metrology
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
129806
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
HT-SEM MonitoringOEMモデルの説明
The PROVision 3E system combines nanometer resolution, high speed, and through-layer imaging to produce the millions of datapoints needed to correctly pattern today’s most advanced designs, including 3nm foundry-logic chips, GAA transistors, and next-generation DRAM and 3D NAND. With these capabilities, it sees beyond the blind spots of optical metrology, performing accurate measurements across the wafer and between the many layers of a chip to generate the multidimensional data sets needed to achieve the best chip performance and accelerate time to market.ドキュメント
ドキュメントなし