メインコンテンツにスキップ
Moov logo

Moov Icon
APPLIED MATERIALS (AMAT) PROVision
    説明
    説明なし
    構成
    AMAT Provision 2e
    OEMモデルの説明
    The PROVision 3E system combines nanometer resolution, high speed, and through-layer imaging to produce the millions of datapoints needed to correctly pattern today’s most advanced designs, including 3nm foundry-logic chips, GAA transistors, and next-generation DRAM and 3D NAND. With these capabilities, it sees beyond the blind spots of optical metrology, performing accurate measurements across the wafer and between the many layers of a chip to generate the multidimensional data sets needed to achieve the best chip performance and accelerate time to market.
    ドキュメント

    ドキュメントなし

    verified-listing-icon

    検証済み

    カテゴリ
    Metrology

    最終検証: 30日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    134601


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    APPLIED MATERIALS (AMAT) PROVision

    APPLIED MATERIALS (AMAT)

    PROVision

    Metrology
    ヴィンテージ: 0状態: 中古
    最終確認30日以上前

    APPLIED MATERIALS (AMAT)

    PROVision

    verified-listing-icon
    検証済み
    カテゴリ
    Metrology
    最終検証: 30日以上前
    listing-photo-a58ba1c3310b489dbc50b631f458baf5-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    134601


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    AMAT Provision 2e
    OEMモデルの説明
    The PROVision 3E system combines nanometer resolution, high speed, and through-layer imaging to produce the millions of datapoints needed to correctly pattern today’s most advanced designs, including 3nm foundry-logic chips, GAA transistors, and next-generation DRAM and 3D NAND. With these capabilities, it sees beyond the blind spots of optical metrology, performing accurate measurements across the wafer and between the many layers of a chip to generate the multidimensional data sets needed to achieve the best chip performance and accelerate time to market.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    APPLIED MATERIALS (AMAT) PROVision

    APPLIED MATERIALS (AMAT)

    PROVision

    Metrologyヴィンテージ: 0状態: 中古最終検証:30日以上前
    APPLIED MATERIALS (AMAT) PROVision

    APPLIED MATERIALS (AMAT)

    PROVision

    Metrologyヴィンテージ: 0状態: 中古最終検証:60日以上前