説明
説明なし構成
W deposition with pulsed nucleation layer (PNL ) hardware and process capability Reactive Plasma Clean ( RPC) hardware. Chamber system that uses plasma NF3 rather than C2F6 Minimal Ovelap Exclusion Ring ( MOER)- keeps W from depositing on the edge of the wafer Installation & TrainingOEMモデルの説明
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.ドキュメント
ドキュメントなし
LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2"
検証済み
カテゴリ
MOCVD
最終検証: 60日以上前
主なアイテムの詳細
状態:
Refurbished
稼働ステータス:
不明
製品ID:
69602
ウェーハサイズ:
8"/200mm
ヴィンテージ:
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2"
カテゴリ
MOCVD
最終検証: 60日以上前
主なアイテムの詳細
状態:
Refurbished
稼働ステータス:
不明
製品ID:
69602
ウェーハサイズ:
8"/200mm
ヴィンテージ:
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
W deposition with pulsed nucleation layer (PNL ) hardware and process capability Reactive Plasma Clean ( RPC) hardware. Chamber system that uses plasma NF3 rather than C2F6 Minimal Ovelap Exclusion Ring ( MOER)- keeps W from depositing on the edge of the wafer Installation & TrainingOEMモデルの説明
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.ドキュメント
ドキュメントなし