説明
KLA-5100XP Super precision measurement devise構成
-Process Superposition measuring device -SMIF Interface: None System configuration KLA-5100 (Superposition measuring device) Inspection Station Alignment system: KLAASP automatic alignment system Stage system: 2-stage high-precision stage (piezo crystal control) Focus system: 2-stage Z-axis operation (piezo crystal control) Optics: LINNIK optics Wafer Loader Systems Transport system: 2 cassette loader / unloader - Pre-alignment: OF detection function Control Console Menu Terminal Image Display Terminal KLA-5501 Analysis Station DEC VLC4000 16MB RAM 320/525MB QIC tape drive 3.5inch F.D.drive(IBM PC 互換 1.44M) option KLASS III Software Package Image Hard Copy Printer (LA75 equivalent) SECS Software 26-wafer compatible option Patlite 2GB Hard Disk Library Setup Basic equipment specifications Wafer Size Wafer Diameter (mm): 200 Wafer thickness (μm): 725 Wafer Pattern For orifura, the pattern is aligned within 2° For wafer sizes of 100 mm or more, 9 patterns are attached to at least 82 mm in both X and Y directions. At least two or more chips are exposed in the Y direction Die Size Minimum 3 mm, maximum 50 mm (one side) Wafer Conveyance Capable of processing 2 SEMI standard 25-piece cassettes Measurement wafer designation is randomly programmable Wafer Alignment Fully automatic non-contact alignment method that does not require special alignment targets Targets for superposition accuracy measurement (1) Concentric box-type targets (2) The outer target is 15μm or more and 30μm or less (recommended size: 20μm) (3) The inner target is about 1/2 the size of the outer target (4) The angle of inclination of the edge of the target is 80~90° Measurement accuracy (using KLA Stsdard Wafer) Repeatability (3 sigma) 5 nm or less (when superposition error 2 μm or less) TIS (Tool Induced Shift) (using KLA Standard Wefer) The TIS value measured by the following equation is 5 nm or less. TIS=(X0+X180)/2 TISY(Y0+Y180)/2 The average of X and Y superposition deviations is X0 and Y0, respectively. The average of X and Y superposition deviations measured by rotating the wafer 180 ° is X180 and Y180, respectively. Measurement throughput 85 or more sheets per hour (when measuring 5 points in the wafer plane) data processing Various statistical calculations and graphic display are possible Utility power 50/60Hz AC200V 20A Single Phase 1 System 100V AC 20A Single Phase 1 System 4pcs for Monitor/Printer/Maintenance Clean dry air or dry N2 (dew point -40°C, 2μm filter required) 1 piece for KLA-5100 Flow rate: 84.9l/min, pressure 603kg/cm2~7.7kg/cm2 1/4 inch tube vacuum 3 pcs for KLA-5100 Vacuum: 635mmHg, Flow rate: 28.3l/min 1/4 inch tube exhaust 1 4.5inch (115mm) Φ duct system Flow rate: 250cfm (7m3/min or more) Temperature environment 19°C~25°C Fluctuation of ambient temperature of equipment ±0.8°C vibration Attached Vibration chart reference External dimensions and weight KLA5100 Inspection Station 1340mm(W)×1200mm(D)×1700mm(H) 1000kg Control Console 560mm(W)×900mm(D)×2000mm(H) 80kg Line Conditioner 310mm(W)×550mm(D)×270mm(H) 50kgOEMモデルの説明
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KLA
5100
検証済み
カテゴリ
Overlay
最終検証： 9日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
114080
ウェーハサイズ：
8"/200mm
ヴィンテージ：
1996
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA
5100
カテゴリ
Overlay
最終検証： 9日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
114080
ウェーハサイズ：
8"/200mm
ヴィンテージ：
1996
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
KLA-5100XP Super precision measurement devise構成
-Process Superposition measuring device -SMIF Interface: None System configuration KLA-5100 (Superposition measuring device) Inspection Station Alignment system: KLAASP automatic alignment system Stage system: 2-stage high-precision stage (piezo crystal control) Focus system: 2-stage Z-axis operation (piezo crystal control) Optics: LINNIK optics Wafer Loader Systems Transport system: 2 cassette loader / unloader - Pre-alignment: OF detection function Control Console Menu Terminal Image Display Terminal KLA-5501 Analysis Station DEC VLC4000 16MB RAM 320/525MB QIC tape drive 3.5inch F.D.drive(IBM PC 互換 1.44M) option KLASS III Software Package Image Hard Copy Printer (LA75 equivalent) SECS Software 26-wafer compatible option Patlite 2GB Hard Disk Library Setup Basic equipment specifications Wafer Size Wafer Diameter (mm): 200 Wafer thickness (μm): 725 Wafer Pattern For orifura, the pattern is aligned within 2° For wafer sizes of 100 mm or more, 9 patterns are attached to at least 82 mm in both X and Y directions. At least two or more chips are exposed in the Y direction Die Size Minimum 3 mm, maximum 50 mm (one side) Wafer Conveyance Capable of processing 2 SEMI standard 25-piece cassettes Measurement wafer designation is randomly programmable Wafer Alignment Fully automatic non-contact alignment method that does not require special alignment targets Targets for superposition accuracy measurement (1) Concentric box-type targets (2) The outer target is 15μm or more and 30μm or less (recommended size: 20μm) (3) The inner target is about 1/2 the size of the outer target (4) The angle of inclination of the edge of the target is 80~90° Measurement accuracy (using KLA Stsdard Wafer) Repeatability (3 sigma) 5 nm or less (when superposition error 2 μm or less) TIS (Tool Induced Shift) (using KLA Standard Wefer) The TIS value measured by the following equation is 5 nm or less. TIS=(X0+X180)/2 TISY(Y0+Y180)/2 The average of X and Y superposition deviations is X0 and Y0, respectively. The average of X and Y superposition deviations measured by rotating the wafer 180 ° is X180 and Y180, respectively. Measurement throughput 85 or more sheets per hour (when measuring 5 points in the wafer plane) data processing Various statistical calculations and graphic display are possible Utility power 50/60Hz AC200V 20A Single Phase 1 System 100V AC 20A Single Phase 1 System 4pcs for Monitor/Printer/Maintenance Clean dry air or dry N2 (dew point -40°C, 2μm filter required) 1 piece for KLA-5100 Flow rate: 84.9l/min, pressure 603kg/cm2~7.7kg/cm2 1/4 inch tube vacuum 3 pcs for KLA-5100 Vacuum: 635mmHg, Flow rate: 28.3l/min 1/4 inch tube exhaust 1 4.5inch (115mm) Φ duct system Flow rate: 250cfm (7m3/min or more) Temperature environment 19°C~25°C Fluctuation of ambient temperature of equipment ±0.8°C vibration Attached Vibration chart reference External dimensions and weight KLA5100 Inspection Station 1340mm(W)×1200mm(D)×1700mm(H) 1000kg Control Console 560mm(W)×900mm(D)×2000mm(H) 80kg Line Conditioner 310mm(W)×550mm(D)×270mm(H) 50kgOEMモデルの説明
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ドキュメントなし