説明
説明なし構成
- Precio standard application software (PSAS) - Auto alignment system (needle tip, wafer) - Bi-temp (room and hot chuck) - Semi Automatic Probe Card Changer option - Chuck camera Unite II - Bridge camera Unit II - Alarm monitor - Real time wafer map disp - Single opener loader - 480sq headplate frame - 440mm base headplate adapter (no interface) - Hot chuck (50C-150C) - GPIB I/F (w/cable 4m) - STD WAPP - Peral brush - LCD panel standard - LAN network kit - Touch pen - Top side OCROEMモデルの説明
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.ドキュメント
ドキュメントなし
TEL / TOKYO ELECTRON
PRECIO
検証済み
カテゴリ
Probers
最終検証： 27日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
103558
ウェーハサイズ：
不明
ヴィンテージ：
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
TEL / TOKYO ELECTRON
PRECIO
カテゴリ
Probers
最終検証： 27日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
103558
ウェーハサイズ：
不明
ヴィンテージ：
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
- Precio standard application software (PSAS) - Auto alignment system (needle tip, wafer) - Bi-temp (room and hot chuck) - Semi Automatic Probe Card Changer option - Chuck camera Unite II - Bridge camera Unit II - Alarm monitor - Real time wafer map disp - Single opener loader - 480sq headplate frame - 440mm base headplate adapter (no interface) - Hot chuck (50C-150C) - GPIB I/F (w/cable 4m) - STD WAPP - Peral brush - LCD panel standard - LAN network kit - Touch pen - Top side OCROEMモデルの説明
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.ドキュメント
ドキュメントなし