説明
Software: PSAS (PRECIO Standard Application Software)構成
Auto alignment system (Needle tip, wafer) Chuck camera unit-II Bridge camera unit-II Alarm monitor Real time wafer map display Single opener loader Headplate frame: 480 SQ Base headplate adapter: 40 mm Loader type: FOUP Chuck temperature: Hot GPIB I/F STD WAPP Pearl brush LCD Panel standard LAN Network kit Touch pen Top side OCR No chiller Wafer table Direct dock capability Pogo tower with INTEST interfaceOEMモデルの説明
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.ドキュメント
ドキュメントなし
TEL / TOKYO ELECTRON
PRECIO
検証済み
カテゴリ
Probers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
101023
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
TEL / TOKYO ELECTRON
PRECIO
カテゴリ
Probers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
101023
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Software: PSAS (PRECIO Standard Application Software)構成
Auto alignment system (Needle tip, wafer) Chuck camera unit-II Bridge camera unit-II Alarm monitor Real time wafer map display Single opener loader Headplate frame: 480 SQ Base headplate adapter: 40 mm Loader type: FOUP Chuck temperature: Hot GPIB I/F STD WAPP Pearl brush LCD Panel standard LAN Network kit Touch pen Top side OCR No chiller Wafer table Direct dock capability Pogo tower with INTEST interfaceOEMモデルの説明
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.ドキュメント
ドキュメントなし