説明
No Hard Drive included. May need TEL or third-party support for OS and software installation. Prior owner’s internal policy is to remove hard drives from all their resale equipment before releasing.構成
Dual FOUP Interface Wafer size (mm): 200, 300 Stage technology: Linear motor No Hinge Manipulator Temperature Control System SACC FOUP Auto Loader Floppy Disk Drive GP-IB interface Combo Interface Cold Chuck -55C to 150C Chiller TEL model C325, down to -25d C Semi automatic Probe card changerOEMモデルの説明
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.ドキュメント
ドキュメントなし
TEL / TOKYO ELECTRON
PRECIO
検証済み
カテゴリ
Probers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled
製品ID：
112499
ウェーハサイズ：
8"/200mm, 12"/300mm
ヴィンテージ：
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
TEL / TOKYO ELECTRON
PRECIO
カテゴリ
Probers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled
製品ID：
112499
ウェーハサイズ：
8"/200mm, 12"/300mm
ヴィンテージ：
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
No Hard Drive included. May need TEL or third-party support for OS and software installation. Prior owner’s internal policy is to remove hard drives from all their resale equipment before releasing.構成
Dual FOUP Interface Wafer size (mm): 200, 300 Stage technology: Linear motor No Hinge Manipulator Temperature Control System SACC FOUP Auto Loader Floppy Disk Drive GP-IB interface Combo Interface Cold Chuck -55C to 150C Chiller TEL model C325, down to -25d C Semi automatic Probe card changerOEMモデルの説明
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.ドキュメント
ドキュメントなし