ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.

The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.

説明

構成

OEMモデルの説明

ドキュメント

EAGLE XP

ALD

主なアイテムの詳細

同様のリスト

EAGLE XP

ALD

主なアイテムの詳細

説明

構成

OEMモデルの説明

ドキュメント

同様のリスト

EAGLE XP

EAGLE XP

EAGLE XP

EAGLE XP

EAGLE XP

EAGLE XP