説明
Al, Ta Sputtering Process The C2 is using Ta-Al, Al-Cu targets for PVD sputtering on 6 inches wafers. The film is Ta-Al 1100 Ao, Al-Cu 5200 Ao. The production run rate is 75 wafers every pump down which translates to 2 hrs. Normally the machine can do 5-6 pump down on a 12 hours shift. That translates to about 375-450 wafers output per shift or 750-900 wafers per day. The current layout is Loadlock, Orienter / Desorb, Transport, 2 Process Chambers. More process chambers can be added depending on process needs. Each process chamber is equipped with an on-board 8 CryoPump.構成
-Cassette Load Lock Modules - Come with 3 casettes, a Motion Engineering Inc (MEI) 3 axis single arms robot, - Leybold TMP/NT 150/360V/H turbo pump -Desorb Modules For wafer orientation and lamps heating, Leybold TMP/NT 150/360V/H turbo pump -Transport Modules Brooks MultiTran 5 Bi-symmetric frog-leg type dual arm robot. Leybold TMP 151/361, 600 and 1000 turbo pump. -PVD Cathode AE MDX Magatron Drive Power Supply . CTI cryo on board 8 and 8300 compressor. VAT Gate valve series 14 AlCu target 14” diameter -PVD Cathode Same as 4. TaAl target 14” diameterOEMモデルの説明
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.ドキュメント
ドキュメントなし
LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2"
検証済み
カテゴリ
CVD
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
45660
ウェーハサイズ：
6"/150mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2"
カテゴリ
CVD
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
45660
ウェーハサイズ：
6"/150mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Al, Ta Sputtering Process The C2 is using Ta-Al, Al-Cu targets for PVD sputtering on 6 inches wafers. The film is Ta-Al 1100 Ao, Al-Cu 5200 Ao. The production run rate is 75 wafers every pump down which translates to 2 hrs. Normally the machine can do 5-6 pump down on a 12 hours shift. That translates to about 375-450 wafers output per shift or 750-900 wafers per day. The current layout is Loadlock, Orienter / Desorb, Transport, 2 Process Chambers. More process chambers can be added depending on process needs. Each process chamber is equipped with an on-board 8 CryoPump.構成
-Cassette Load Lock Modules - Come with 3 casettes, a Motion Engineering Inc (MEI) 3 axis single arms robot, - Leybold TMP/NT 150/360V/H turbo pump -Desorb Modules For wafer orientation and lamps heating, Leybold TMP/NT 150/360V/H turbo pump -Transport Modules Brooks MultiTran 5 Bi-symmetric frog-leg type dual arm robot. Leybold TMP 151/361, 600 and 1000 turbo pump. -PVD Cathode AE MDX Magatron Drive Power Supply . CTI cryo on board 8 and 8300 compressor. VAT Gate valve series 14 AlCu target 14” diameter -PVD Cathode Same as 4. TaAl target 14” diameterOEMモデルの説明
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.ドキュメント
ドキュメントなし