説明

Applied Materials Endura 5500 • Wafer Size: 200mm • Cleanroom Interface: Endura HP Front Panel • Controller: PVD Endura Type Controller 55-5-1030-B • VME PC Hardware • VHP Transfer Robot: VHP Robot 55-6-1036 • HP Buffer Robot • Deep Pocket Transfer Blade & Metal Buffer Robot Blade • Standard SECS RS 232 Communication 55-8-1045

構成

CHAMBER 1 • Titanium PVD Widebody Chamber • CTI Fast Regen Enhanced Cryo Pump 3-phase (subject to availability) • 12kW CEM Master PVD Power Supply • PVD Wafer Chuck: Unclamped • IMP Advanced 101 Type Pedestal- VECT-P1-5072 • Mag Coupled Shutter, VOR Match • HP Motorized Lift • PVD Pressure Control: 3 Position Gate Valve • Cryo Restrictors • PVD Chamber Safety Option: EMO On Source Cover • Chamber Lid Clamp Lever Extension • SST Cover Ring • Shield Material & Type Option: Aluminum One Piece • Short Detect w/Impedance Network CHAMBERS 2/3 • (2) HP TxZ CVD Titanium-Nitride Chambers- HP TxZ-m3 • BC hardware/TxZ heaters • Heater Power Cables- 0150-76286 CHAMBER A • Pass-Through Chamber • Quartz Viewport Lid CHAMBER B • Cooldown Chamber • Quartz Viewport Lid CHAMBER C/D • (2) Preclean II Chambers CHAMBER E/F • (2) Orienters with Enhanced Degas – 55-E/F-5748

OEMモデルの説明

AMAT leveraged its expertise in single-wafer, multichamber architecture to develop an evolutionary platform called the Endura 5500 PVD (physical vapor deposition) in 1990 featuring a staged, ultra-high vacuum architecture for the rapid sputtering of aluminum and other metal films used to form the circuit interconnections on advanced devices.