説明
Last processed 6” wafer was Oct’21, currently the tool is not running with power-off condition.構成
6" , can be upgraded to 8" 2 chambers SiO2 Clusterline machine that consist of 2x LL(LoadLock/Loading module) + TM(transfer module) + 1x Aligner(detect wafer flat) + 2x PM(process chamber) + 3x Degasser. The process chamber had run gases of O2, SF6, Ar, He, N2O, N2, NH3, SiH4, H2. Only process chamber was deposited with Silicon Nitride/Silicon OxideOEMモデルの説明
提供なしドキュメント
ドキュメントなし
EVATEC / UNAXIS / OERLIKON / BALZERS
CLUSTERLINE 200
検証済み
カテゴリ
PVD / Sputtering
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Installed / Running
製品ID：
102898
ウェーハサイズ：
6"/150mm, 8"/200mm
ヴィンテージ：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVATEC / UNAXIS / OERLIKON / BALZERS
CLUSTERLINE 200
カテゴリ
PVD / Sputtering
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Installed / Running
製品ID：
102898
ウェーハサイズ：
6"/150mm, 8"/200mm
ヴィンテージ：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Last processed 6” wafer was Oct’21, currently the tool is not running with power-off condition.構成
6" , can be upgraded to 8" 2 chambers SiO2 Clusterline machine that consist of 2x LL(LoadLock/Loading module) + TM(transfer module) + 1x Aligner(detect wafer flat) + 2x PM(process chamber) + 3x Degasser. The process chamber had run gases of O2, SF6, Ar, He, N2O, N2, NH3, SiH4, H2. Only process chamber was deposited with Silicon Nitride/Silicon OxideOEMモデルの説明
提供なしドキュメント
ドキュメントなし