
説明
Last processed 6” wafer was Oct’21, currently the tool is not running with power-off condition.構成
6" , can be upgraded to 8" 2 chambers SiO2 Clusterline machine that consist of 2x LL(LoadLock/Loading module) + TM(transfer module) + 1x Aligner(detect wafer flat) + 2x PM(process chamber) + 3x Degasser. The process chamber had run gases of O2, SF6, Ar, He, N2O, N2, NH3, SiH4, H2. Only process chamber was deposited with Silicon Nitride/Silicon OxideOEMモデルの説明
提供なしドキュメント
ドキュメントなし
カテゴリ
PVD / Sputtering
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
Installed / Running
製品ID:
102898
ウェーハサイズ:
6"/150mm, 8"/200mm
ヴィンテージ:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示EVATEC / UNAXIS / OERLIKON / BALZERS
CLUSTERLINE 200
カテゴリ
PVD / Sputtering
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
Installed / Running
製品ID:
102898
ウェーハサイズ:
6"/150mm, 8"/200mm
ヴィンテージ:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Last processed 6” wafer was Oct’21, currently the tool is not running with power-off condition.構成
6" , can be upgraded to 8" 2 chambers SiO2 Clusterline machine that consist of 2x LL(LoadLock/Loading module) + TM(transfer module) + 1x Aligner(detect wafer flat) + 2x PM(process chamber) + 3x Degasser. The process chamber had run gases of O2, SF6, Ar, He, N2O, N2, NH3, SiH4, H2. Only process chamber was deposited with Silicon Nitride/Silicon OxideOEMモデルの説明
提供なしドキュメント
ドキュメントなし