説明
Spare Parts構成
構成なしOEMモデルの説明
System enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.ドキュメント
ドキュメントなし
KLA / VISTEC / LEICA
LDS3300 C
検証済み
カテゴリ
Reticle / Mask Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Parts Tool
稼働ステータス:
不明
製品ID：
101281
ウェーハサイズ：
2"/50mm
ヴィンテージ：
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / VISTEC / LEICA
LDS3300 C
カテゴリ
Reticle / Mask Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Parts Tool
稼働ステータス:
不明
製品ID：
101281
ウェーハサイズ：
2"/50mm
ヴィンテージ：
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Spare Parts構成
構成なしOEMモデルの説明
System enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.ドキュメント
ドキュメントなし