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説明
Laser Saw Main body Main power Loadlock Laser type：A type No Chiller構成
Voltage: 200~240 VAC ± 10%, 3 PhaseOEMモデルの説明
The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.ドキュメント
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DISCO
DFL7160
カテゴリ
Scribing, Cutting, Dicing
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
111433
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2009
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