AS-2000
カテゴリ
Wet processing概要(Overview)
The new post-CMP cleaner improves throughput by 50% by reducing wafer transfer and drying time. Footprint is also reduced by optimally arranging each processing unit. Moreover, inline configuration with chemical mechanical polisher is also possible.
現在の掲載品
9
サービス
検査、保証、鑑定、ロジスティクス