説明
Includes four bond chambers, interface, control cabinet, power rack and heat exchanger.構成
EVG560/200/4 120mm-200mm and 150mm-200mm bondingOEMモデルの説明
The EVG560 automated wafer bonding system accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm. Based on the same bond chamber design and incorporating the key features of EVG's manual bonding systems with enhanced process control and automation, the EVG560 bonder delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers.ドキュメント
ドキュメントなし
カテゴリ
Wafer Bonders
最終検証： 2日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
150303
ウェーハサイズ：
6"/150mm, 8"/200mm
ヴィンテージ：
2020
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
EVGroup (EVG)
EVG560
カテゴリ
Wafer Bonders
最終検証： 2日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
150303
ウェーハサイズ：
6"/150mm, 8"/200mm
ヴィンテージ：
2020
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Includes four bond chambers, interface, control cabinet, power rack and heat exchanger.構成
EVG560/200/4 120mm-200mm and 150mm-200mm bondingOEMモデルの説明
The EVG560 automated wafer bonding system accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm. Based on the same bond chamber design and incorporating the key features of EVG's manual bonding systems with enhanced process control and automation, the EVG560 bonder delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers.ドキュメント
ドキュメントなし