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DISCO DFG841
    説明
    説明なし
    構成
    FULL-AUTO
    OEMモデルの説明
    The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.
    ドキュメント

    ドキュメントなし

    DISCO

    DFG841

    verified-listing-icon

    検証済み

    カテゴリ
    Wafer Grinding

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    63113


    ウェーハサイズ:

    4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm


    ヴィンテージ:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    DISCO DFG841

    DISCO

    DFG841

    Wafer Grinding
    ヴィンテージ: 2000状態: 部品ツール
    最終確認14日前

    DISCO

    DFG841

    verified-listing-icon
    検証済み
    カテゴリ
    Wafer Grinding
    最終検証: 60日以上前
    listing-photo-74465ec0ba7944308a724d107b79576a-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    63113


    ウェーハサイズ:

    4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm


    ヴィンテージ:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    FULL-AUTO
    OEMモデルの説明
    The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    DISCO DFG841

    DISCO

    DFG841

    Wafer Grindingヴィンテージ: 2000状態: 部品ツール最終検証:14日前
    DISCO DFG841

    DISCO

    DFG841

    Wafer Grindingヴィンテージ: 0状態: 中古最終検証:60日以上前
    DISCO DFG841

    DISCO

    DFG841

    Wafer Grindingヴィンテージ: 1998状態: 中古最終検証:60日以上前