説明
説明なし構成
構成なしOEMモデルの説明
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.ドキュメント
ドキュメントなし
DISCO
DFG841
検証済み
カテゴリ
Wafer Grinding
最終検証： 15日前
主なアイテムの詳細
状態：
Parts Tool
稼働ステータス:
不明
製品ID：
111210
ウェーハサイズ：
不明
ヴィンテージ：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
DISCO
DFG841
カテゴリ
Wafer Grinding
最終検証： 15日前
主なアイテムの詳細
状態：
Parts Tool
稼働ステータス:
不明
製品ID：
111210
ウェーハサイズ：
不明
ヴィンテージ：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.ドキュメント
ドキュメントなし