メインコンテンツにスキップ
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon
DISCO DFG8560
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.
    ドキュメント

    ドキュメントなし

    DISCO

    DFG8560

    verified-listing-icon

    検証済み

    カテゴリ
    Wafer Grinding

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    13478


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2003


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    DISCO DFG8560

    DISCO

    DFG8560

    Wafer Grinding
    ヴィンテージ: 0状態: 中古
    最終確認今日

    DISCO

    DFG8560

    verified-listing-icon
    検証済み
    カテゴリ
    Wafer Grinding
    最終検証: 60日以上前
    listing-photo-6VCQMGW_sD1-i0J8chhLeSHWnongLZ9zTC1PhVqeQyU-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    13478


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2003


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    DISCO DFG8560

    DISCO

    DFG8560

    Wafer Grindingヴィンテージ: 0状態: 中古最終検証:今日
    DISCO DFG8560

    DISCO

    DFG8560

    Wafer Grindingヴィンテージ: 2011状態: 中古最終検証:28日前
    DISCO DFG8560

    DISCO

    DFG8560

    Wafer Grindingヴィンテージ: 2011状態: 中古最終検証:28日前